Display packaging structure and manufacturing method thereof
A technology of packaging structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., to achieve the effect of reducing distance and ultra-narrow frame design
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[0048] The description of the following embodiments refers to the attached drawings to illustrate specific embodiments that the present invention can be implemented. Furthermore, the directional terms mentioned in the present invention, such as up, down, top, bottom, front, back, left, right, inside, outside, side, surrounding, center, horizontal, horizontal, vertical, vertical, axial, The radial direction, the uppermost layer or the lowermost layer, etc., are only the direction of reference to the attached drawings. Therefore, the directional terms used are used to describe and understand the present invention, rather than to limit the present invention.
[0049] Please refer to figure 1 As shown, the first embodiment of the present invention provides a display structure to achieve the foregoing objective of the present invention. The display structure includes: a cover 10 having a main body portion 11A and an extension portion 11B; and a display element substrate 20 having a s...
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