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Display packaging structure and manufacturing method thereof

A technology of packaging structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., to achieve the effect of reducing distance and ultra-narrow frame design

Active Publication Date: 2019-07-23
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of this, the present invention provides a display packaging structure and its manufacturing method to solve the problem existing in the prior art that the width of the packaging sealant needs to be sacrificed to achieve a narrow frame design

Method used

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  • Display packaging structure and manufacturing method thereof
  • Display packaging structure and manufacturing method thereof
  • Display packaging structure and manufacturing method thereof

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Embodiment Construction

[0048] The description of the following embodiments refers to the attached drawings to illustrate specific embodiments that the present invention can be implemented. Furthermore, the directional terms mentioned in the present invention, such as up, down, top, bottom, front, back, left, right, inside, outside, side, surrounding, center, horizontal, horizontal, vertical, vertical, axial, The radial direction, the uppermost layer or the lowermost layer, etc., are only the direction of reference to the attached drawings. Therefore, the directional terms used are used to describe and understand the present invention, rather than to limit the present invention.

[0049] Please refer to figure 1 As shown, the first embodiment of the present invention provides a display structure to achieve the foregoing objective of the present invention. The display structure includes: a cover 10 having a main body portion 11A and an extension portion 11B; and a display element substrate 20 having a s...

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Abstract

The invention discloses a display packaging structure and a manufacturing method thereof. The display packaging structure includes a cover and a display element substrate. The cover is combined with the display element substrate so that an extending part of the cover surrounds a side wall of the display element substrate and then a gap is formed between the extending part and the side wall; and the display packaging structure further includes a sealant filling the gap. According to the invention, the extending part of the cover surrounds the side wall of the display element substrate, then thedistance between an OLED device and the edge of the display panel is reduced and the packaging effect is not affected, thereby an ultra narrow bezel design is realized.

Description

Technical field [0001] The present invention relates to a display packaging structure and a manufacturing method thereof, in particular to a display packaging structure with a narrow frame and a manufacturing method thereof. Background technique [0002] In recent years, organic light emitting diodes (Organic Light Emitting Diode, OLED) have the advantages of self-luminescence, high contrast, fast response time, and flexible display, so they are widely used. The difference between OLED display and traditional liquid crystal display is that OLED display does not require a backlight module. OLED devices inject into organic thin film materials through electron and hole carriers and emit light on the organic material. However, organic materials are very sensitive to water vapor and oxygen, and water / oxygen penetration will greatly reduce the life of the device. In order to meet the requirements of commercialization for device life and stability, OLED devices have very high requireme...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/846H10K50/8426H10K71/00
Inventor 谭伟张亮
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD