Device and method for cutting crystal rod

Abstract

The invention provides a device and method for cutting a crystal rod. The cutting device comprises a bearing platform, a detection mechanism, a cutting mechanism, a moving mechanism and a control mechanism, wherein the bearing platform is used to carry the crystal rod to be cut, and an adjusting mechanism for rotating and / or deflecting the crystal rod is arranged on the bearing platform; the detection mechanism is used to detect a crystal orientation deviation angle of the crystal rod; the cutting mechanism is used to cut the crystal rod; the moving mechanism is used to move the bearing platform; and the control mechanism is used to control the adjusting mechanism to adjust the crystal rod to a preset crystal orientation deviation angle according to a detection result and the cutting mechanism to cut the crystal rod after the crystal rod is moved to a preset position by moving the bearing mechanism by the moving mechanism. The crystal orientation deviation angle of the crystal rod is adjusted by the adjusting mechanism according to the cutting device, and the crystal rod is adjusted to the preset crystal orientation deviation angle according to the detection result, so that the cutting surface of a silicon block is perpendicular to the physical crystal orientation; and then the cutting mechanism is controlled to cut the crystal rod, so that the cutting quality is improved, thesurface quality of silicon wafers when the silicon block is cut into the silicon wafers is improved, and the situation that the crystal orientation deviation angle of the silicon block is within a control range during cutting the silicon block is ensured.

Description

technical field [0001] The invention relates to the field of silicon chip processing, in particular to a cutting device and a cutting method for crystal rods. Background technique [0002] Semiconductor devices are signal or energy control and conversion devices prepared by various processes on single crystal silicon wafers with the same crystal orientation. The crystal orientation of a single crystal silicon wafer is an important indicator for controlling the performance of a semiconductor, and it is generally required that the angle between the physical crystal orientation of the silicon wafer and the geometric central axis of the silicon wafer be controlled within ±0.5°. At present, the processing process for large-sized ingots above 8 inches is as follows: ingot rounding (ingot surface treatment), V-groove opening, band saw cutting (cutting ingots into silicon blocks), silicon block orientation orientation Bonding, multi-wire cutting (cutting silicon blocks into silicon...

AI Technical Summary

Problems solved by technology

[0003] In view of this, the present invention provides a cutting device and a method for cutting crystal rods, which are used to solve the large deviation of the crystal orientation angle of the silicon block during cutting, which will easily lead to poor surface quality of the cut silicon chips. The problem of high defect rate

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