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A kind of preparation method of printed circuit board

A technology for printed circuit boards and substrates, which is applied in the direction of printed circuits, printed circuit manufacturing, and circuit substrate materials. Accumulation of copper and tin in the hole, the effect of high product yield

Active Publication Date: 2021-07-30
DIGITAL PRINTED CIRCUIT BOARD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to ensure the conductivity of the hole copper, it is generally necessary to increase the thickness of the hole copper, that is, to increase the thickness of the hole copper to 1.2~1.4mil. However, during the electroplating process, due to the excessive thickness of the hole copper, it is easy to accumulate copper in the hole, and It is also easy to accumulate tin in the hole in the subsequent solder mask process, which affects the quality of the circuit board

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A method for preparing a printed circuit board, comprising the following steps:

[0031] S1 material delivery: prepare aluminum plate and prepreg;

[0032] S2 Coarsening: Use 0.5mol / L sodium hydroxide solution to corrode the aluminum plate for 5 minutes to form a rough surface. The roughness Ra of the formed rough surface is 1.1, which is beneficial to improve the aluminum plate after subsequent lamination. The fit of the prepreg prevents the prepreg from falling off;

[0033] S3 Tin plating: Spray tin plating on the lower surface of the aluminum plate to form a protective tin film;

[0034] S4 Lamination: Stack the aluminum plate and the prepreg in sequence, fix the edges with rivets, put them in a press machine and press them into shape to obtain a primary plate;

[0035] S5 one-time drilling: drilling the primary board to form a through hole;

[0036] S6 conductive glue plug hole: use conductive glue to fill the through hole, and grind the two ends to make it smoo...

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PUM

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Abstract

The invention provides a method for preparing a printed circuit board, comprising the following steps: S1 material sending, S2 roughening, S3 tinning, S4 pressing, S5 primary drilling, S6 conductive rubber plug hole, S7 secondary drilling , S8 electroplating, S9 dry film, S10 etching, S11 solder mask, S12 text, S13 cutting board. The preparation method of the printed circuit board provided by the invention can avoid the phenomenon of copper accumulation and tin accumulation in the through hole, and has good circuit continuity and high product yield.

Description

technical field [0001] The invention relates to the field of multilayer circuit board processing, in particular to a method for preparing a printed circuit board. Background technique [0002] A circuit board, also known as a printed circuit board, is the provider of electrical connections for electronic components. Its development has a history of more than 100 years, and its design is mainly layout design. The main advantage of using circuit boards is that it greatly reduces wiring and assembly errors, and improves the automation level and production labor rate. According to the number of layers of circuit boards, printed circuit boards can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards. [0003] For multi-layer circuit boards, the traditional production methods are: cutting, pressing, drilling, electroplating, dry film, etching, solder mask, text, and fishing. In order to ensure the cond...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/02H05K3/06H05K1/05
CPCH05K1/05H05K3/0011H05K3/0017H05K3/002H05K3/0047H05K3/0052H05K3/0094H05K3/022H05K3/06
Inventor 张涛张东锋
Owner DIGITAL PRINTED CIRCUIT BOARD CO LTD