Silicon wafer de-gluing machine and control method thereof

Abstract

The invention provides a silicon wafer de-gluing machine which comprises a primary filter box which is communicated with a first tank and used for recovering waste water discharged from the tank; a secondary filter box which is communicated with the primary filter box and used for filtering the water discharged from the primary filter box; a tertiary filter box which is communicated with the secondary filter tank and a third tank and used for filtering the water discharged from the secondary filter box and recovering the waste water discharged from the third tank; a water storage tank which iscommunicated with the tertiary filter box and the first tank and used for storing water discharged from the tertiary filter tertiary and supplying spray water to the first tank; a heater which is isarranged between the water storage tank and the first tank and used for heating water discharged from the water storage tank; a pure water source which replenishes the water storage tank with the spray water; and a controller which detects existence of silicon wafers sprayed in the spray tank by position sensors arranged in the first tank, the second tank and the third tank and discharges the spray water from the water storage tank and/or the pure water source. The invention also provides a control method of the silicon wafer de-gluing machine. The surface quality of the silicon wafer can be improved, the spray water can be recycled, the production cost can be reduced and the product quality can be improved.

Description

technical field [0001] The invention belongs to the technical field of degumming of solar-grade monocrystalline silicon wafers, and in particular relates to a silicon wafer degumming machine and a control method thereof. Background technique [0002] In the production process of solar silicon wafers, the surface quality of silicon wafers is high, and the degumming process is an auxiliary process of wire cutting and cleaning. The degumming process directly affects the surface quality of subsequent silicon wafer cleaning. In the existing degumming machine, the silicon chip unloaded from the cutting machine enters the spray tank together with the resin plate for spray pre-cleaning, the purpose is to remove the silicon powder and cutting fluid adhered to the surface of the silicon chip, and at the same time clean the resin plate. The glue is softened, and the cutting fluid is the coolant used when cutting the silicon rod with the diamond cutting wire, and the pure water content ...

AI Technical Summary

Problems solved by technology

[0004] The problem to be solved by the present invention is to provide a silicon chip degumming machine and its control method, especially suitable for the recovery device and its control of the spray liquid in the spray tank process, which solves the problem of the spray effect in the spray process in the prior art. Poor, can not meet the existing production technology requirements, the technical problem of low utilization rate of spray water, the purpose is to improve the surface quality of silicon wafers, reduce production costs and improve product quality

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