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LED chip and preparation method thereof, chip wafer, micro-led display device

A technology of LED chips and semiconductors, applied in semiconductor devices, electrical components, circuits, etc., can solve problems affecting the luminous efficiency of LED chips

Active Publication Date: 2021-04-02
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Embodiments of the present invention provide an LED chip and its preparation method, a chip wafer, and a Micro-LED display device, which can solve the problem that the side wall of the LED chip is damaged to form a leakage channel, thereby affecting the luminous efficiency of the LED chip.

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  • LED chip and preparation method thereof, chip wafer, micro-led display device
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  • LED chip and preparation method thereof, chip wafer, micro-led display device

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Embodiment Construction

[0045] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0046] An embodiment of the present invention provides a chip wafer, such as figure 1 As shown, a substrate 1 and a plurality of LED chips 2 disposed on the substrate 1 are included.

[0047] Here, the material of the substrate 1 is not limited, and the material of the substrate 1 may be, for example, one or more of a sapphire substrate, a silicon substrate, or a gallium nitride (GaN) substrate.

[0048] Those skilled in the art should understand that a plura...

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Abstract

The embodiments of the present disclosure provide an LED chip and method for fabrication thereof, chip wafer, and Micro-LED display device. the LED chip (2) comprises a first semiconductor pattern (20), a light emission pattern (30), and a second semiconductor pattern (40), arranged stacked in sequence; the boundary of the orthographic projection of the first semiconductor pattern (20) and / or the second semiconductor pattern (40) on the light emission pattern (30) is located within the boundary of the light emission pattern (30); the first semiconductor pattern (20), the second semiconductor pattern (40), and the light emission pattern (30) have overlapping regions along the direction of the thickness of the LED chip (2); the first semiconductor pattern (20) is an n-type semiconductor, and the second semiconductor pattern (40) is a p-type semiconductor; alternatively, the first semiconductor pattern (20) is a p-type semiconductor, and the second semiconductor pattern (40) is an n-type semiconductor. The embodiments of the present disclosure can prevent the leakage channel formed because of the damage of the side wall of the LED chip (2), and further prevent the impact thereof on the luminous efficiency of the LED chip (2).

Description

technical field [0001] The invention relates to the field of display technology, in particular to an LED chip and a preparation method thereof, a chip wafer, and a Micro-LED display device. Background technique [0002] A light emitting diode (Light Emitting Diode, referred to as LED) is a semiconductor element that can convert electrical energy into light in a specific wavelength range. The light-emitting principle of light-emitting diodes is the recombination of electrons and holes to emit light. [0003] Light-emitting diodes have the advantages of low power consumption, small size, high brightness, easy matching with integrated circuits, and high reliability. They are often widely used as light sources at present. With the maturity of LED technology, LED display devices or Micro-LED (micro-LED) display devices that directly use LEDs as sub-pixels are gradually developed. Contents of the invention [0004] Embodiments of the present invention provide an LED chip and i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/15H01L33/00H01L33/20
CPCH01L27/156H01L33/0095H01L33/20
Inventor 侯孟军李延钊孟虎刘宗民
Owner BOE TECH GRP CO LTD