A 3D printing integrated heat sink and its application in phased array antenna

Abstract

The present invention relates to the field of heat dissipation, specifically refers to a microchannel heat sink, integrated manufacturing and its application in control array antennas. The present invention adopts 3D printing to manufacture the heat sink, and through fluid channels with gradually changing distribution, they are respectively arranged in the largest flow channels. The liquid injection port and the liquid outlet port at the smallest end allow the coolant to pass through the entire fluid channel evenly. The maximum temperature of the radiator is 298K and the minimum temperature is 295K during use. Compared with, the heat dissipation ability is stronger, the temperature distribution after heat dissipation is more uniform, and it has the characteristics of good heat dissipation and temperature uniformity, and no need to use nut sealing rings for packaging in one-time molding.

Description

technical field

[0001] The invention relates to the field of heat dissipation, in particular to a heat sink, a method for manufacturing the heat sink, and a heat dissipation device for array antenna microchannels. Background technique

[0002] With the development of electronic systems in the direction of miniaturization and integration, integrated multifunctional electronic systems and devices have emerged as the times require. With the improvement of the integration of various original devices, the packaging density is getting smaller and smaller, and the heat flux density of the electronic system is increasing sharply. An electronic system with small size, light weight and efficient heat dissipation is required. The main board and cooling system of the existing electronic equipment The traditional air cooling technology can no longer meet the heat dissipation requirements of high heat flux density devices. The efficient liquid cooling technology can not only meet the elec...

Examples

Embodiment 1

[0042] A radiator, including a heat exchange container for heat exchange and conduction with a heat source, and a liquid injection port 7 and a liquid outlet 8 for heat exchange liquid to flow into and out of the heat exchange container. The flow channel for reducing fluid pressure drop and performing heat exchange, the liquid injection port 7 is located at the largest end of the flow channel in the heat exchange container, and the liquid outlet 8 is located at the smallest end of the flow channel in the heat exchange container.

[0043] Description of the heat exchange container: The heat exchange container is the same as the existing technology, and it only needs to ensure that the heat exchange container is isolated from the heat source and the heat exchange body. It can be in the shape of a plate, a column, a cube, or a "back" As the heat exchange tube used in the shell-and-tube heat exchanger and the tube-sheet heat exchanger in the prior art, it is only necessary to gradu...

Embodiment 2

[0046] The difference between this embodiment and Embodiment 1 is: 1) Provide a structural form of the heat exchange container; 2) Provide a specific structure in which the circulation channel in the heat exchange container gradually increases; 3) For the control array antenna micro Optimize the design of the heat dissipation structure for the specific heat dissipation scenario of the channel; 4) Optimize the design of the position of the liquid injection port 7 and the liquid outlet 8 so that the heat exchange liquid can fully flow through the heat exchange container.

[0047] The repeated parts of this embodiment and embodiment 1 will not be repeated, and only point out the difference here:

[0048] 1) In order to specifically provide a structural form of a heat exchange container, see figure 1 and figure 2 In this embodiment, the heat exchange container is plate-shaped, and is composed of a cold plate 1 and a cover plate 2 that are combined with each other to form a close...

Embodiment 3

[0055] The difference between this embodiment and Embodiment 2 is that Embodiment 2 is for dissipating heat for a 5×5 phased array antenna, while this embodiment is for dissipating heat for an 8×8 phased array antenna, see Figure 5 The only difference between this embodiment and embodiment 2 is that the number of partitions 6 and the number of heat exchange units are adjusted accordingly.

[0056] By analogy, the present invention can be used not only for 5×5 phased array antennas or 8×8 phased array antennas for heat dissipation, but also for more types of phased array antennas for heat dissipation. Since there are many models that can be used, No need to go into details this time, as long as the radiator structure of the present invention is used to dissipate heat for the phased array antenna, it should be included in the scope of protection of this application.

technical field

[0001] The invention relates to the field of heat dissipation, in particular to a heat sink, a method for manufacturing the heat sink, and a heat dissipation device for array antenna microchannels. Background technique

[0002] With the development of electronic systems in the direction of miniaturization and integration, integrated multifunctional electronic systems and devices have emerged as the times require. With the improvement of the integration of various original devices, the packaging density is getting smaller and smaller, and the heat flux density of the electronic system is increasing sharply. An electronic system with small size, light weight and efficient heat dissipation is required. The main board and cooling system of the existing electronic equipment The traditional air cooling technology can no longer meet the heat dissipation requirements of high heat flux density devices. The efficient liquid cooling technology can not only meet the elec...

Examples

Embodiment 1

[0042] A radiator, including a heat exchange container for heat exchange and conduction with a heat source, and a liquid injection port 7 and a liquid outlet 8 for heat exchange liquid to flow into and out of the heat exchange container. The flow channel for reducing fluid pressure drop and performing heat exchange, the liquid injection port 7 is located at the largest end of the flow channel in the heat exchange container, and the liquid outlet 8 is located at the smallest end of the flow channel in the heat exchange container.

[0043] Description of the heat exchange container: The heat exchange container is the same as the existing technology, and it only needs to ensure that the heat exchange container is isolated from the heat source and the heat exchange body. It can be in the shape of a plate, a column, a cube, or a "back" As the heat exchange tube used in the shell-and-tube heat exchanger and the tube-sheet heat exchanger in the prior art, it is only necessary to gradu...

Embodiment 2

[0046] The difference between this embodiment and Embodiment 1 is: 1) Provide a structural form of the heat exchange container; 2) Provide a specific structure in which the circulation channel in the heat exchange container gradually increases; 3) For the control array antenna micro Optimize the design of the heat dissipation structure for the specific heat dissipation scenario of the channel; 4) Optimize the design of the position of the liquid injection port 7 and the liquid outlet 8 so that the heat exchange liquid can fully flow through the heat exchange container.

[0047] The repeated parts of this embodiment and embodiment 1 will not be repeated, and only point out the difference here:

[0048] 1) In order to specifically provide a structural form of a heat exchange container, see figure 1 and figure 2 In this embodiment, the heat exchange container is plate-shaped, and is composed of a cold plate 1 and a cover plate 2 that are combined with each other to form a close...

Embodiment 3

[0055] The difference between this embodiment and Embodiment 2 is that Embodiment 2 is for dissipating heat for a 5×5 phased array antenna, while this embodiment is for dissipating heat for an 8×8 phased array antenna, see Figure 5 The only difference between this embodiment and embodiment 2 is that the number of partitions 6 and the number of heat exchange units are adjusted accordingly.

[0056] By analogy, the present invention can be used not only for 5×5 phased array antennas or 8×8 phased array antennas for heat dissipation, but also for more types of phased array antennas for heat dissipation. Since there are many models that can be used, No need to go into details this time, as long as the radiator structure of the present invention is used to dissipate heat for the phased array antenna, it should be included in the scope of protection of this application.

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