A 3D printing integrated heat sink and its application in phased array antenna

A technology for radiators and heat exchange containers, applied to antennas, antenna arrays, antenna components, etc., can solve the problem of large heat exchange dead volume of heat exchange containers, uneven heat exchange of heat exchange devices, and no consideration of heat exchange uniform temperature performance and other problems, to achieve the effect of large number of partitions, small spacing, and pressure pulsation suppression

Inactive Publication Date: 2020-11-24
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This patent uses the raised part to form a water channel for water cooling and heat exchange, but it does not consider that the flow rate of the heat exchange fluid at the inlet is large, and the pressure drop increases, which reduces the flow rate of the heat exchange fluid in the subsequent process, and the heat exchange fluid with reduced flow rate It cannot fully contact with the inside of the heat exchange container, resulting in a large "heat exchange dead volume" inside the heat exchange container. At the same time, the temperature of the heat exchange fluid rises in the second half of the fluid stroke. In the case of "thermal dead volume", the heat exchange of the whole heat exchange device is extremely uneven, without any heat exchange uniformity effect
[0008] CN200820115950.9 discloses an aluminum pass-through water-cooling heat sink. The water-cooling heat sink is processed with continuously bent water channels inside and is provided with corresponding water inlets and water outlets. As in the above reference document, only water cooling Heat transfer, without considering the uniform temperature performance of heat transfer

Method used

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  • A 3D printing integrated heat sink and its application in phased array antenna
  • A 3D printing integrated heat sink and its application in phased array antenna
  • A 3D printing integrated heat sink and its application in phased array antenna

Examples

Experimental program
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Effect test

Embodiment 1

[0042] A radiator, including a heat exchange container for heat exchange and conduction with a heat source, and a liquid injection port 7 and a liquid outlet 8 for heat exchange liquid to flow into and out of the heat exchange container. The flow channel for reducing fluid pressure drop and performing heat exchange, the liquid injection port 7 is located at the largest end of the flow channel in the heat exchange container, and the liquid outlet 8 is located at the smallest end of the flow channel in the heat exchange container.

[0043] Description of the heat exchange container: The heat exchange container is the same as the existing technology, and it only needs to ensure that the heat exchange container is isolated from the heat source and the heat exchange body. It can be in the shape of a plate, a column, a cube, or a "back" As the heat exchange tube used in the shell-and-tube heat exchanger and the tube-sheet heat exchanger in the prior art, it is only necessary to gradu...

Embodiment 2

[0046] The difference between this embodiment and Embodiment 1 is: 1) Provide a structural form of the heat exchange container; 2) Provide a specific structure in which the circulation channel in the heat exchange container gradually increases; 3) For the control array antenna micro Optimize the design of the heat dissipation structure for the specific heat dissipation scenario of the channel; 4) Optimize the design of the position of the liquid injection port 7 and the liquid outlet 8 so that the heat exchange liquid can fully flow through the heat exchange container.

[0047] The repeated parts of this embodiment and embodiment 1 will not be repeated, and only point out the difference here:

[0048] 1) In order to specifically provide a structural form of a heat exchange container, see figure 1 and figure 2 In this embodiment, the heat exchange container is plate-shaped, and is composed of a cold plate 1 and a cover plate 2 that are combined with each other to form a close...

Embodiment 3

[0055] The difference between this embodiment and Embodiment 2 is that Embodiment 2 is for dissipating heat for a 5×5 phased array antenna, while this embodiment is for dissipating heat for an 8×8 phased array antenna, see Figure 5 The only difference between this embodiment and embodiment 2 is that the number of partitions 6 and the number of heat exchange units are adjusted accordingly.

[0056] By analogy, the present invention can be used not only for 5×5 phased array antennas or 8×8 phased array antennas for heat dissipation, but also for more types of phased array antennas for heat dissipation. Since there are many models that can be used, No need to go into details this time, as long as the radiator structure of the present invention is used to dissipate heat for the phased array antenna, it should be included in the scope of protection of this application.

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Abstract

The present invention relates to the field of heat dissipation, specifically refers to a microchannel heat sink, integrated manufacturing and its application in control array antennas. The present invention adopts 3D printing to manufacture the heat sink, and through fluid channels with gradually changing distribution, they are respectively arranged in the largest flow channels. The liquid injection port and the liquid outlet port at the smallest end allow the coolant to pass through the entire fluid channel evenly. The maximum temperature of the radiator is 298K and the minimum temperature is 295K during use. Compared with, the heat dissipation ability is stronger, the temperature distribution after heat dissipation is more uniform, and it has the characteristics of good heat dissipation and temperature uniformity, and no need to use nut sealing rings for packaging in one-time molding.

Description

technical field [0001] The invention relates to the field of heat dissipation, in particular to a heat sink, a method for manufacturing the heat sink, and a heat dissipation device for array antenna microchannels. Background technique [0002] With the development of electronic systems in the direction of miniaturization and integration, integrated multifunctional electronic systems and devices have emerged as the times require. With the improvement of the integration of various original devices, the packaging density is getting smaller and smaller, and the heat flux density of the electronic system is increasing sharply. An electronic system with small size, light weight and efficient heat dissipation is required. The main board and cooling system of the existing electronic equipment The traditional air cooling technology can no longer meet the heat dissipation requirements of high heat flux density devices. The efficient liquid cooling technology can not only meet the elec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/00H01Q21/00H01Q21/06
CPCH01Q1/02H01Q21/00H01Q21/061
Inventor 徐尚龙陈鹏艳谢俊明徐冲陈亮
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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