Ceramic antenna feed hole insulation structure

Abstract

The invention discloses a ceramic antenna feed hole insulation structure. The structure comprises a first antenna, a second antenna, a third antenna, a conductive layer group and a first dielectric layer. The first antenna, the second antenna and the third antenna are stacked, then a first conductive layer, a second conductive layer and a third conductive layer of the conductive layer group and afirst dielectric layer, a second dielectric layer and a third dielectric layer of the dielectric layer group are configured in a third through hole, a second through hole and a first through hole of the first antenna and the fourth through hole of the second antenna to allow feed paths of the first feed module of the first antenna, the second feed module of the second antenna and the third feed module of the third antenna to reach impedance characteristics of 50 ohms as a copper-axis cable, the antennas are not mismatched, and the original receiving efficiency of the antennas is ensured.

Description

technical field [0001] The invention relates to an antenna, in particular to a ceramic antenna feed-in hole insulation structure whose feed-in path has the characteristics of a copper-axis cable. Background technique [0002] The wireless communication systems currently used on the market include at least: Global Navigation Satellite System (GNSS), Dedicated Short-Range Communication System (DSRC), Satellite Digital Audio Radio Service System (SDARS), Long Term Evolution Technology System (LTE), wireless network system (WLAN / BT), etc. And the global navigation satellite system includes global, regional and enhanced, such as Global Positioning System (Global Positioning System, GPS), GLONASS (GLONASS) is the global satellite navigation system (GLOBAL NAVIGATION SATELLITE SYSTEM) in Russian The abbreviation of Galileo Positioning System (Galileo), Beidou Satellite Navigation System, and related augmentation systems, such as WAAS (Wide Area Augmentation System), EGNOS (Europea...

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Problems solved by technology

[0004] Although multiple antennas are installed on the circuit board, the electronic equipment is less restricted by the place and area of ​​use when receiving signals, but the circuit board of the electronic equipment needs to integrate multiple antennas, and each antenna has a specific size , and the scattered positions are all different and occupy space, which will lead to a larger area of ​​the circuit board, and also make the housing or space installed on the circuit board relatively larger, thus causing difficulties in integration

[0005] Therefore, in order to solve the above problems, multiple antennas are manufactured in a stacked manner. Since multiple antennas are stacked, the thickness of the antenna will increase. Once the thickness of the antenna increases, the feed-in path of the antenna signal is likely to be mismatched, which cannot Reaching the 50 ohm impedance characteristic of the copper axis cable, thereby reducing the effectiveness of the antenna

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