A method for preparing a display substrate and a display substrate

Abstract

The present application discloses a method for preparing a display substrate and the display substrate, which are used to increase the yield of tearing the film while reducing the difficulty of tearing the film. A method for preparing a display substrate provided in an embodiment of the present application includes: disposing a first protective film on the entire back surface of a display panel; wherein, the display panel has: a region to be bent, and at least one region to be bent extends in the same direction as The first cutting area to be connected to the bending area; the first protective film has a second cutting area and a film area to be torn, and the film area to be torn is disconnected from other areas outside the film area to be torn; the film area to be torn includes: One area to be torn off and the second area to be torn off, the first area to be torn off overlaps with the area to be bent, the area formed by the second area to be torn off and the second cutting area coincides with the first cutting area; cutting removes the second A cutting area and a second cutting area; take the first protective film in the second area to be torn off as the starting point of the tearing film, and tear off the first protective film in the area to be torn off.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a method for preparing a display substrate and the display substrate. Background technique [0002] At present, the production of full-screen Organic Light-Emitting Diode (OLED) display products requires a terminal bending process after obtaining an OLED panel with a back film attached. The terminal bending process needs to remove the back film. In the prior art, the method of removing the backing film is to use laser point input to "ablate" the grooves in the target area through a large number of dense vertical laser dot arrays, so as to remove the backing film in the bending area. However, due to the mutual thermal influence between the laser spots, the depth of the laser removal of the backing film is not easy to control, and is often accompanied by sintering residues of the backing film and pressure sensitive adhesive (PSA), and the bottom flatness of the backing ...

AI Technical Summary

Problems solved by technology

However, due to the mutual thermal influence between the laser spots, the depth of laser removal of the backing film is not easy to control, and is often accompanied by sintering residues of the backing film and pressure sensitive adhesive (PSA), and the bottom flatness of the backing film removal area is poor. And there is a risk of foreign matter, and the hot working area of ​​laser sintering is relatively large, and the sintering edge often has gaps caused by thermal deformation of the material, which affects the shape of the sintering edge and then affects the stress distribution

[0003] To sum up, it is difficult to remove the back film in the existing technology, and the process of removing the back film is prone to sintering residues, and there will also be gaps at the sintering edge, which affects the yield of the back film removal and the quality of the display product.

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