Method for processing hole and slot on ceramic product

Abstract

The invention discloses a method for processing a hole and a slot on a ceramic product. During hole processing, a grinding wheel rod is utilized for carrying out impact processing on an area of a preprocessing hole of the ceramic product so as to obtain a corresponding blind hole site, wherein the depth of impact processing is smaller than the target depth of the preprocessing hole, and the hole diameter of the blind hole site has a working allowance compared with the target hole diameter of the preprocessing hole; the grinding wheel rod is utilized for carrying out screw feed processing on anon-penetrating part in the blind hole site so as to obtain a corresponding through hole site, wherein the feeding speed of screw feed processing is smaller than or equal to 0.02 mm / circle; and the through hole site is finely trimmed and ground, and the working allowance is removed, so that a target processing hole site is obtained. According to the method for processing the hole, the whole processing time of the hole is shortened, the working efficiency on processing the hole is improved, and the problem of causing edge breakage on the edge of the hole can be avoided. In addition, the methodfor processing the slot adopts the core thought of the hole processing, so that the working efficiency can be improved as well, and meanwhile, the problem of causing edge breakage on the edge can be avoided.

Description

technical field [0001] The invention relates to the technical field of ceramic processing, in particular to a method for processing holes and grooves on ceramic products. Background technique [0002] At present, ceramic materials are used in many electronic devices, such as the casing of mobile phones. Housings on electronic products often require holes and slots, such as USB holes, earphone holes, power holes, sound amplifier holes, and card tray holes in the middle frame of mobile phones. However, products made of ceramic materials have the characteristics of high hardness, brittleness, and easy cracking during processing, which makes traditional laser drilling unable to meet the surface finish requirements. Chipping at the edge of a hole or slot. In addition, for small and long U-shaped grooves, the use of a single screw-feed processing method not only has disadvantages such as low processing efficiency, large tool life loss, and unstable dimensions, but also tends to ...

AI Technical Summary

Problems solved by technology

However, products made of ceramic materials have the characteristics of high hardness, brittleness, and easy cracking during processing, which makes traditional laser drilling unable to meet the surface finish requirements. Chipping at the edge of a hole or slot

In addition, for small and long U-shaped grooves, the use of a single screw-feed processing method not only has disadvantages such as low processing efficiency, large tool life loss, and unstable dimensions, but also tends to cause cracking when processing to the edge of the hole.

Therefore, the current processing methods for processing holes or grooves in ceramic products generally have the problems of low processing efficiency and easy cracking of the edges.

[0003] In summary, how to solve the problems of low processing efficiency and easy cracking of edges when processing holes or grooves in ceramic products has become a technical problem to be solved urgently by those skilled in the art.

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