Wafer loading device, wafer loading method and wafer cleaning equipment
A technology for wafers and conveyors, used in transportation and packaging, electrical components, conveyor objects, etc., and can solve problems such as low cleaning efficiency
Active Publication Date: 2021-02-26
BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
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[0005] The object of the present invention is to provide a wafer loading device, a wafer loading method and a wafer cleaning equipment, so as to alleviate the technical problems that the wafer cleaning equipment in the prior art can only adapt to one cleaning route and have low cleaning efficiency
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[0078] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0079] In the description of the present invention, it should be noted that the terms "first", "second", and "third" are used for description purposes only, and should not be understood as indicating or implying relative importance.
[0080] In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral ...
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The invention relates to the technical field of wafer wet cleaning equipment, in particular to a wafer loading device, a wafer loading method and wafer cleaning equipment. In the wafer loading device, the first magazine transfer device can accept the magazine at the first station and transfer it to the second station, and the manipulator can grab the wafer in the magazine at the second station and transfer it to The first position, and the first material box transfer device can transfer the empty material box at the second station to the first station; the second material box transfer device can accept the material box at the third station, and the manipulator can grasp The wafers in the magazines at the third station are taken and transferred to the second location. The wafer loading method is applied to the above-mentioned wafer loading device. The wafer cleaning equipment includes the above-mentioned wafer loading device. The wafer loading device, wafer loading method and wafer cleaning equipment provided by the present invention can adapt to at least two cleaning routes, and the cleaning efficiency is high.
Description
technical field [0001] The present invention relates to the technical field of wafer wet cleaning equipment, in particular to a wafer loading device, a wafer loading method and wafer cleaning equipment. Background technique [0002] With the development of the semiconductor industry, the critical dimensions of device cleaning technology are constantly shrinking, and there are higher requirements for the cleanliness of the wafer in each process of wafer processing and cleaning. [0003] However, the existing wafer loading device used in the process of cleaning the wafer can only adapt to one cleaning route, therefore, the wafer cleaning equipment can only work along one cleaning route, and the cleaning efficiency is low. [0004] To sum up, how to overcome the above-mentioned defects of the existing wafer cleaning equipment is a technical problem to be solved urgently by those skilled in the art. Contents of the invention [0005] The object of the present invention is to ...
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IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67017H01L21/67763
Inventor 赵宝君祝福生王文丽张富聪安稳鹏
Owner BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC