Circuit board and solder paste arrangement method thereof, and electronic device
An arrangement method and technology of electronic devices, which are applied in the directions of printed circuits, printed circuit manufacturing, and assembling printed circuits with electrical components, can solve problems such as the inability to precisely control the position accuracy, avoid solder joint voids, avoid space interference, and improve welding. the effect of strength
Inactive Publication Date: 2019-08-30
OPPO CHONGQING INTELLIGENT TECH CO LTD
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Problems solved by technology
When making the board, the position accuracy of the green oil cannot be precisely controlled. When the coverage area is too large, the exposed area of the pad will decrease. The same volume of solder paste will increase the height due to the reduced area during soldering, so that the electronic components will be placed on the top. High interference machine assembly
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[0017] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the specific embodiments described here are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only some structures related to the present application are shown in the drawings but not all structures. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.
[0018] Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phr...
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The invention discloses a circuit board. The circuit board comprises a substrate, at least one bonding pad arranged on the substrate and a solder mask arranged on the substrate and the bonding pad, the solder mask is provided with an opening, the bonding pad comprises an exposed portion exposed through the opening, the exposed portion comprises a first sub exposed portion and a second sub exposedportion, the size of the first sub exposed portion in a first direction is larger than that of the second sub exposed portion in the first direction. According to the mode mentioned above, the empty welding spot can be avoided, the welding strength is improved, and the too large space between the electronic element and the bonding pad after welding can be avoided.
Description
technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a circuit board, a solder paste arrangement method thereof, and an electronic device. Background technique [0002] At present, electronic devices such as smart phones have gradually become a necessity in people's lives, and circuit boards are a necessary component in electronic devices. [0003] The soldering surface of the electronic device (for example, photosensitive device) on the traditional circuit board is at the bottom of the body, and the gas generated by the "redox" reaction of rosin is difficult to volatilize during patch soldering, and the internal gas of the molten solder paste has no time to "escape". Air bubbles (also known as solder joint voids) form after the solder joint cools. Voiding in solder joints will result in a decrease in solder strength. [0004] In order to improve the bonding strength between the pad and the circuit board substrate, g...
Claims
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IPC IPC(8): H05K1/18H05K3/34
CPCH05K1/18H05K3/3485
Inventor 邓东武
Owner OPPO CHONGQING INTELLIGENT TECH CO LTD