A kind of three-dimensional circuit board integrated preparation method and three-dimensional circuit board

Abstract

The embodiment of the invention relates to an integrated preparation method of a three-dimensional circuit board and a three-dimensional circuit board. The method comprises the following steps of: (1)constructing a three-dimensional model file according to the three-dimensional structure of a three-dimensional circuit board to be prepared, and performing layered slicing on the three-dimensional model file to generate a printing program; (2) printing UV insulating ink on the surface of a printing platform by using the insulating ink extrusion head according to the printing program in the environment of UV light radiation, and performing curing to obtain a supporting substrate; (3) printing UV insulating ink on the surface of the supporting substrate by using the insulating ink extrusion head according to the printing program in the environment of UV light radiation, and performing curing to obtain an insulating layer; and (4) and printing UV conductive ink on the area outside the insulating layer on the surface of the supporting substrate by using the conductive ink extrusion head according to the printing program under the environment of UV light radiation, and performing wiring.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of circuit boards, and in particular to an integrated preparation method for a three-dimensional circuit board and a three-dimensional circuit board. Background technique [0002] The circuit board is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. Almost all electronic devices are inseparable from circuit boards, from electronic watches, general-purpose computers, televisions, to supercomputers, communication electronic equipment, military weapon systems, etc., as long as there are electronic components such as integrated circuits, they are electrically interconnected All circuit boards are used. [0003] Traditional integrated circuit chip processing or common circuit board manufacturing technologies in various electronic devices are all subtractive manufacturing technologies, that is, remo...

AI Technical Summary

Problems solved by technology

[0003] Traditional integrated circuit chip processing or common circuit board manufacturing technologies in various electronic devices are all subtractive manufacturing technologies, that is, removing unnecessary materials by plasma etching or acid corrosion to form a graphic structure of functional materials. The process is complicated, there are many procedures, and it consumes a lot of energy, copper and chemical materials, and the waste water, waste liquid, waste residue and so on also cause serious pollution to the environment.

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