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Sectional exposure method of reel-to-reel maskless laser direct-writing photoetching device

A technology of laser direct writing and lithography equipment, which is applied in the direction of microlithography exposure equipment, photomechanical equipment, photo-plate making process exposure equipment, etc., and can solve the problem of exposure pattern height limitation and other issues

Active Publication Date: 2019-09-03
HEFEI CHIP FOUND MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the previous laser direct writing lithography equipment, the height of the exposure pattern is strictly limited by the stroke of the scanning axis, and only the pattern whose height is smaller than the stroke of the scanning axis can be exposed

Method used

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  • Sectional exposure method of reel-to-reel maskless laser direct-writing photoetching device
  • Sectional exposure method of reel-to-reel maskless laser direct-writing photoetching device
  • Sectional exposure method of reel-to-reel maskless laser direct-writing photoetching device

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Embodiment Construction

[0017] The present invention will be further described below in conjunction with accompanying drawing:

[0018] Such as Figure 1-Figure 2 Shown is a segmented exposure method for roll-to-roll maskless laser direct writing lithography equipment. This method is to cut the ultra-high pattern into several segments, and each segment of the graphic is used as an independent exposure graphic to make a material number. When there is a suitable alignment hole, it can be directly aligned for exposure. When there is no suitable alignment hole, the exposure of the second segment needs to expose two marks of the material number of the previous segment as the target of the alignment exposure of the latter segment until all segment splicing is completed. The part number of the last graphic does not need to expose two positioning marks. Specifically, the method includes the following steps:

[0019] (1) Cutting superelevation graphics: cutting the superelevation graphics to be exposed int...

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PUM

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Abstract

The invention relates to a sectional exposure method of a reel-to-reel maskless laser direct-writing photoetching device. The method comprises the following steps of: (1) cutting an ultrahigh pattern;(2) making and marking material numbers; (3) exposing a material number of the first section; (4) acquiring theoretical sucker coordinates; (5) exposing the material number of the nth section; (6) repeating the steps (4) and (5) until all the sectional material numbers of the graph are exposed. The sectional exposure method of a reel-to-reel maskless laser direct-writing photoetching device can solve the defects in the prior art and can expose the graph with the height exceeding the stroke of a scanning axis.

Description

technical field [0001] The invention relates to the technical field of roll-to-roll laser direct writing lithography equipment, in particular to a segmented exposure method for roll-to-roll maskless laser direct writing lithography equipment. Background technique [0002] The roll-to-roll maskless laser direct writing lithography equipment is composed of an unwinder, an exposure machine and a winder. In roll-to-roll laser direct writing lithography equipment, the exposure substrate is a roll of flexible board with a fixed width and infinite length, so it meets the conditions for exposing ultra-high graphics on a board. However, the length of the exposure table is limited, and the stroke of the scanning axis is also fixed. In order to enable the roll-to-roll laser direct writing lithography equipment to process ultra-high graphics that exceed the stroke of the scanning axis of the exposure machine, the segmented exposure function was developed. In the previous laser direct w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20
CPCG03F7/2022G03F7/70358G03F7/70383G03F7/70425
Inventor 董帅王勇
Owner HEFEI CHIP FOUND MICROELECTRONICS EQUIP CO LTD
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