The invention discloses a polyimide oligomer and a liquid photoimagable solder resist ink. A structural formula of the polyimide oligomer is as follows: R1 is alicyclic, R2 is alkyl with at least one carbon ring structure, n is not less than 1 and not more than 30, m is not less than 1 and not more than 30, p is not less than 1 and not more than 30, and (n+1-m-p) is more than 0, x is not less than 5 and not more than 50. The photoimagable polyimide oligomer has the advantages of excellent heat resistance, soldering resistance, golden resistance, chemical resistance, and yellowing resistance. The liquid photoimagable solder resist ink prepared from the oligomer has excellent heat resistance, soldering resistance, golden resistance, chemical resistance, yellowing resistance, insulativity, high resolution, high flexibility and high adhesion, can be used for effectively solving the problem that the liquid photoimagable solder resist ink is easy to yellow at high temperature under the processes of thermocuring, solder coating and reflow soldering, and is especially suitable for preparing white solder resist ink so as to achieve high reflecting whiteness.