The invention discloses a
polyimide oligomer and a liquid photoimagable solder
resist ink. A
structural formula of the
polyimide oligomer is as follows: R1 is alicyclic, R2 is
alkyl with at least one carbon ring structure, n is not less than 1 and not more than 30, m is not less than 1 and not more than 30, p is not less than 1 and not more than 30, and (n+1-m-p) is more than 0, x is not less than 5 and not more than 50. The photoimagable
polyimide oligomer has the advantages of excellent
heat resistance,
soldering resistance, golden resistance,
chemical resistance, and yellowing resistance. The liquid photoimagable solder
resist ink prepared from the oligomer has excellent
heat resistance,
soldering resistance, golden resistance,
chemical resistance, yellowing resistance, insulativity,
high resolution, high flexibility and
high adhesion, can be used for effectively solving the problem that the liquid photoimagable solder
resist ink is easy to yellow at high temperature under the processes of thermocuring, solder
coating and
reflow soldering, and is especially suitable for preparing white solder resist ink so as to achieve high reflecting whiteness.