Work structure for providing scanning path of immersion photoetching machine

Abstract

The invention discloses a work structure for providing a scanning path of an immersion photoetching machine. The work structure comprises a silicon wafer which is arranged below an exposure lens of the immersion photoetching machine, and the work structure is characterized in that the silicon wafer comprises a plurality of wafers, and each of the plurality of wafers further comprises a bottom anti-reflection layer and a photo resist; and a plurality of wafers comprise the wafers in a central scanning path area and the wafers in a peripheral scanning path area, and the central scanning path area and the peripheral scanning path area are both in the spiral scanning path structures. According to the work structure provided by the invention, the wafers in the silicon wafer to be exposed are divided into two areas, and the two areas are both in the spiral scanning work path structures, in this way, most part of the silicon wafer is prevented from being impacted by the particles, and the exposure quality can be achieved and the yield of the product can be increased.

Description

Technical field [0001] The invention relates to the field of microelectronics, in particular to a working structure for providing a scanning path of an immersion lithography machine. Background technique [0002] With the rapid development of semiconductors, immersion lithography machines are uniformly adopted in the industry for 55nm processes and below. Because the immersion lithography machine uses pure water to improve the resolution during exposure, and when using pure water for exposure, more particles are introduced. The source is mainly the particles on the back of the silicon wafer at the edge of the wafer. [0003] This is because the source of particles during exposure is mainly introduced during exposure to the edge of the silicon wafer, and the particles introduced during exposure are mainly introduced when exposed to the edge of the silicon wafer (wafer edge), because pure water will diffuse to the back of the wafer; because usually the wafer The back side is the mai...

AI Technical Summary

Problems solved by technology

[0004] like figure 1 as shown in figure 1 Including a silicon wafer 1, the silicon wafer includes a plurality of wafers (wafer) 2, the traditional scanning path structure is exposed from the top of the wafer in an "S" shape, but the working structure of the scanning path is due to premature exposure to the wafer edge position , so as to introduce particles, which will cause the influence of particles in the next exposure process, so that the dies in the first row are all affected by particles in pure water, so that the product yield rate of wafers is low due to exposure problems

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