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Laser blind hole alignment method of HDI multi-layer plate

A multi-layer board, laser technology, applied in the direction of multi-layer circuit manufacturing, electrical components, printed circuit manufacturing, etc., can solve the problems of laser alignment deviation, machining accuracy error, reduce laser blind hole accuracy, etc., to improve accuracy, simplify Process, cost reduction effect

Inactive Publication Date: 2019-09-06
江门市众阳电路科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional processing method of laser alignment hole is to drill the positioning hole through the target punching machine, and then use mechanical drilling to complete the hole. Due to the machining accuracy error of the mechanical drilling machine itself, there is a laser alignment deviation, which reduces the accuracy of the laser blind hole.

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  • Laser blind hole alignment method of HDI multi-layer plate
  • Laser blind hole alignment method of HDI multi-layer plate

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Embodiment Construction

[0019] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be further described in detail below in conjunction with the drawings and specific embodiments.

[0020] If there are directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention, they are only used to explain the relative positions of the components in a certain posture (as shown in the drawings) relationship, motion, etc., if the particular pose changes, the directional indication changes accordingly.

[0021] In addition, in the present invention, the descriptions involving "first", "second" and so on are only for the purpose of description, and should not be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined as ...

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Abstract

The embodiment of the invention discloses a laser blind hole alignment method of an HDI multi-layer plate. The laser blind hole alignment method comprises the steps of A, opening a material; B, arranging an inner-layer circuit; C, browning; D, lamination; E, performing x-ray target practice; F, performing laser; G, performing plasma; and H, horizontally depositing copper. By the laser blind hole alignment method, the step of processing a laser alignment hole by mechanical drilling is omitted, the flow is simplified, the cost is reduced, meanwhile, laser deviation caused by a processing error due to mechanical drilling is also reduced, and the laser blind hole accuracy of the multi-layer plate is substantially improved.

Description

technical field [0001] The invention relates to the technical field of circuit board printing, in particular to a positioning method for laser blind holes of an HDI multilayer board. Background technique [0002] In the printed circuit board industry, when producing high-density interconnected printed circuit boards, it is difficult to control the alignment between laser blind holes and graphics. The traditional alignment processing method of laser blind holes in HDI multi-layer boards is completed by using a mechanical drilling machine to use inner layer target holes for positioning. [0003] The actual processing accuracy of laser blind holes in HDI multilayer boards is mainly affected by the following two aspects: the processing accuracy of the laser machine itself, and the accuracy of laser alignment holes. The traditional processing method of laser alignment hole is to drill the positioning hole through the target punching machine, and then use mechanical drilling to c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4638H05K2203/095H05K2203/107
Inventor 赖建春陈亮钟志杰
Owner 江门市众阳电路科技有限公司