Adjustable water-based cutting device based on brittle materials

Abstract

The invention discloses an adjustable water-based cutting device based on brittle materials. The device comprises a main body, wherein a working cavity is formed in the main machine body, a material plate can be placed on the bottom wall of the working cavity, the left side of the material plate is provided with a clamping mechanism which can enable the material plate to be clamped and slide rightwards, a positioning box is arranged on the upper side of the material plate, five rotating rods which are symmetrically arranged in a front and back mode are arranged on the bottom surface of the positioning box in a rotating mode, fine drills are fixedly arranged on the lower side surface of the rotating rods, and five small holes can be drilled in the top surface of the material plate through rotation and up-down short-distance vibration of the fine drills. The cost of cutting equipment of the brittle materials can be effectively reduced, on the basis that expensive laser positioning and laser cutting equipment is not used, only a water-based cutting mode is used, so that the materials can be prevented from being damaged during size cutting.

Description

technical field [0001] The invention relates to the technical field of cutting, in particular to an adjustable water-based cutting device based on brittle materials. Background technique [0002] Brittle materials such as LCD screens are usually difficult to cut, and the surface will be cracked if the cutting is slightly unstable or the cutting temperature is too high. Generally, relatively high-end laser positioning and laser cutting equipment are used, but this equipment is usually expensive Both are very high, and it is difficult for some small factories or stores to maintain the cost, and ordinary wire cutting equipment is difficult to clamp brittle materials, and cannot cut stably. In addition, cutting directly on the surface of brittle materials with wire It is likely to cause cracks. Drilling must be carried out first. Using a well-positioned shallow hole to cut will reduce cracks. The general drilling device is large in size and the drilling contact time is long, whi...

AI Technical Summary

Problems solved by technology

[0002] Brittle materials such as LCD screens are usually difficult to cut, and the surface will be cracked if the cutting is slightly unstable or the cutting temperature is too high. Generally, relatively high-end laser positioning and laser cutting equipment are used, but this equipment is usually expensive Both are very high, and it is difficult for some small factories or stores to maintain the cost, and ordinary wire cutting equipment is difficult to clamp brittle materials, and cannot cut stably. In addition, cutting directly on the surface of brittle materials with wire It is likely to cause cracks. Drilling must be carried out first. Using a well-positioned shallow hole to cut will reduce cracks. The general drilling device is large in size and the drilling contact time is long, which will also cause cracks.

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