Chip packaging process and chip packaging structure

Abstract

The invention discloses a chip packaging process. The chip packaging process comprises the following steps of: baking a substrate inversely equipped with a chip for the first time; cleaning the substrate which is subjected to the first baking and is inversely provided with the chip; performing bottom filling on the cleaned substrate inversely equipped with the chip; baking the substrate which is inversely equipped with the chip and is subjected to the bottom filling for the second time; forming a plurality of grooves on the surface of one side, far away from the substrate, of the chip after backing for the second time; gluing the surface of one side, far away from the substrate, of the chip after grooving; attaching a cover plate on the surface of one side, far away from the substrate, of the chip after gluing; and baking the substrate which is inversely provided with the chip is attached to the cover plate for the third time. The chip packaging process can improve the heat dissipation efficiency of the chip.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a chip packaging process and a chip packaging structure. Background technique [0002] With the advancement of technology, the integration level of integrated circuit chips has been continuously improved, the number of I / O pins has increased sharply, and the power consumption has also increased accordingly, and the requirements for integrated circuit packaging have become more stringent. In order to meet the needs of development, BGA packaging technology began to appear and was applied to manufacturing. [0003] BGA (Ball Grid Array Package) technology is ball grid array packaging technology. Once this technology appeared, it became the best choice for high-density, high-performance, multi-pin packages such as CPUs, motherboard south bridge chips, and north bridge chips. Moreover, the technology adopts the controllable collapse chip welding method, which can improve its ...

AI Technical Summary

Problems solved by technology

[0008] (1) The heat dissipation of the newly designed product increases, and it is difficult for the existing technology to deal with the efficiency of the heat dissipation itself to meet the product demand;

[0009] (2) The size of the internal chip of the newly designed product increases, so the area covered by the glue will increase, and the stress of thermal expansion and contraction of the product in the later use will also increase (the back of the chip and the heat dissipation cover);

[0010] To sum up, the direct conduction of heat dissipation of existing products and newly designed products depends on the physical contact heat dissipation cover on the back of the chip for heat dissipation. to influence

Images