Overturning feeding device for semiconductor encapsulation bonding equipment

A semiconductor and pusher technology, applied in conveyor control devices, transportation and packaging, conveyors, etc., can solve problems such as deformation of the frame base island and scratches on the surface of the frame base island, so as to improve profits and reduce hidden dangers in quality. , the effect of reducing production costs

Pending Publication Date: 2019-09-20
FOSHAN BLUE ROCKET ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to eliminate the existing feeding device of the semiconductor packaging die bonding equipment, especially the feeding device of the SS-DT01 die bonding device, which easily causes the defor

Method used

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  • Overturning feeding device for semiconductor encapsulation bonding equipment
  • Overturning feeding device for semiconductor encapsulation bonding equipment
  • Overturning feeding device for semiconductor encapsulation bonding equipment

Examples

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Example Embodiment

[0043] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0044] Such as Figure 1A , Figure 2A , image 3 , Figure 4A , Figure 5 , Figure 6A And combine Figure 1B , Figure 2B , Figure 4B , Figure 6B As shown, a turning and feeding device for a semiconductor package bonding device includes the following devices or components:

[0045] (1) Flip the feeding device seat frame 9, which includes a bottom plate and two side plates vertically connected to the bottom plate and symmetrically arranged on the left and right sides of the bottom plate. The top front end ( That is, the top front ends of the two side plates are parallel to the ground, and the main part after the top front end of the top of the loading device seat frame 9 is tilted downward at an inclination angle of 30 degrees (that is, the angle between the horizontal plane is 30 degrees) ).

[0046] (2) Frame replenishment device 1, frame placeme...

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Abstract

The invention provides an overturning feeding device for semiconductor encapsulation bonding equipment. The overturning feeding device comprises components as follows: (1), an overturning feeding device seat frame; (2), a frame supply device, a frame placement table, a frame supply device motor and a frame supply position sensor, wherein two grooves are formed in a bottom plate of the frame placement table and the frame supply device can advance or retreat along the grooves under driving of the motor; (3), an overturning frame suction device, an overturning frame suction motor, a front limit sensor, a back limit sensor, a working table track and a working table frame sensor; (4), a lamination-preventing warning device, a pushing device, frame suckers and a pushing device motor, wherein the pushing device is arranged above one end of the working table track, the lamination-preventing warning device 4 is arranged above the other end of the working table track, the frame suckers are arranged on one side of the working table track and parallel to the working table track, and the pushing device motor is arranged below the pushing device and fixedly connected with the front end of the overturning feeding device seat frame.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging equipment, and in particular relates to a flipping and feeding device of semiconductor packaging chip bonding equipment. Background technique [0002] At present, the flipping feeding device of the semiconductor packaging die bonding equipment commonly used by enterprises, such as the feeding device of the SS-DT01 die bonding equipment, adopts the technical solution of the pull-out type splitting device. The defect of this technical solution is: the operation process of the equipment When the frame enters the track from the feeding device, due to the friction between the upper and lower rows of frames, the uncoordinated speed of the frame and the slicing device, etc., it is easy to cause the deformation of the frame base island and the surface of the frame base island to be scratched, etc. Quality hidden dangers, resulting in product waste and increasing the production cost of the ...

Claims

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Application Information

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IPC IPC(8): B65G47/82B65G47/91B65G47/248B65G35/00B65G43/08
CPCB65G35/00B65G43/08B65G47/248B65G47/82B65G47/91B65G2203/042
Inventor 杨全忠姚剑锋张国光陈建雄周元邱锡荣
Owner FOSHAN BLUE ROCKET ELECTRONICS
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