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Integrated circuit manufacturing device and method

A technology for integrated circuits and manufacturing devices, which is applied in circuits, semiconductor/solid-state device manufacturing, resistors, etc., can solve the problems of inability to improve the yield of integrated circuit substrate preparation devices, and achieve convenient production and use, improve production efficiency, and facilitate use. Effect

Active Publication Date: 2019-09-20
伊犁师范大学
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the existing integrated circuit cannot work in a humid environment and the production

Method used

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  • Integrated circuit manufacturing device and method
  • Integrated circuit manufacturing device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Embodiment 1: refer to Figure 1-3 ;

[0033] An integrated circuit manufacturing device includes an ion sputtering machine and a packaging machine, and also includes a substrate preparation machine. The substrate preparation machine is provided with a substrate preparation box 1, and the bottom surface of the substrate preparation box 1 is fixedly equipped with a moving wheel 3. The substrate preparation box 1. There are handles 2 on the upper ends of the left and right sides. The front of the substrate preparation box 1 is movably connected with the box door 4. A control panel 5 is installed on the outer surface of the box door 4. An intelligent production system is installed inside the control panel 5. The left side surface of the substrate preparation box 1 The middle part is provided with a side slot 6, and the lower slot surface of the side slot 6 is provided with a lower notch 7, and the inner slot surface of the side slot 6 is provided with a side slot 8, and a ...

Embodiment 2

[0035] Embodiment 2: refer to Figure 4 , the basis of the embodiment 1 is different in that;

[0036] The pushing mechanism 10 includes a first roller sleeve 16, a second roller sleeve 17 and a rolling platform 20, the peripheral surface of the first roller sleeve 16 is movably connected with the inner surface of one side of the rolling platform 20, and the peripheral surface of the second roller sleeve 16 is It is movably connected with the inner surface on the other side of the rolling table 20, and the middle part of the upper surface of the rolling table 20 is fixedly connected with a push block 24, which matches the lower notch 7, and the two ends of the first roller sleeve 16 are rotatably connected with the second One support connecting shaft 18, the lower end of the first supporting connecting shaft 18 is fixedly connected with the inner bottom surface of the substrate preparation box 1, the two ends of the second roller sleeve 17 are rotatably connected with the seco...

Embodiment 3

[0039] Embodiment 3: refer to Figure 5 , the basis of the embodiment 1 is different in that;

[0040] The fixed mechanism 13 includes a fixed frame 25, the lower surface of the fixed frame 25 is fixedly connected with the inner bottom surface of the substrate preparation box 1 through the support legs 26, the upper and lower sides and the left and right sides of the fixed frame 25 are all connected, and the front and rear lower frames of the fixed frame 25 are fixedly installed with Induction transmission table 27, induction transmission table 27 is electrically connected with control panel 5, electric control hydraulic rod 28 is fixedly installed on the front and rear upper frame surfaces of fixed frame 25, and the lower end of electric control hydraulic rod 28 is fixedly connected with a pressure plate for fastening large substrate 9 29. The right end of the fixed frame 25 is provided with a prolongation groove 30 for the circulation of waste boards. The prolongation groove...

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Abstract

The invention discloses an integrated circuit manufacturing device and method, and belongs to the technical field of integrated circuit manufacturing. The integrated circuit manufacturing device comprises an ion sputtering machine and a packaging machine and further comprises a substrate preparation machine, wherein the substrate preparation machine is provided with a substrate preparation box, the substrate preparation box is equipped with moving wheels, the substrate preparation box is provided with handles, the substrate preparation box is connected with a box door, the outer surface of the box door is equipped with a control panel, the control panel is internally provided with an intelligent production system, the left side surface of the substrate preparation box is provided with a side placement groove at the middle part, the lower groove surface of the side placement groove is provided with a lower notch, the inner groove surface of the side placement groove is provided with a side notch, the side placement groove is internally provided with multiple sets of large substrates, the substrate preparation box is internally provided with a pushing mechanism, an electrically controlled stamping rod, a stamping mechanism, a fixing mechanism, a finished product storage groove and a scrap plate storage groove. The integrated circuit manufacturing device can carry out stamping and molding on substrates quickly and conveniently, facilitates the preparation and application of integrated circuits, saves time and labor, and can improve the productivity of the integrated circuits by combining the integrated circuit manufacturing method.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing, in particular to an integrated circuit manufacturing device and a manufacturing method thereof. Background technique [0002] An integrated circuit is a tiny electronic device or component. It is a semiconductor manufacturing process such as oxidation, photolithography, diffusion, epitaxy, aluminum evaporation, etc., which integrates semiconductors, resistors, capacitors and other components required to form a circuit with certain functions and the connecting wires between them into a small piece of silicon. On-chip, and then weld the electronic device packaged in a tube to become a microstructure with the required circuit function; all the components have been integrated in the structure, making the electronic components towards miniaturization, low power consumption and intelligence. And a big step forward in terms of high reliability. The emergence and application of...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/677H01L21/329H01L23/64H01L21/56G01N27/02
CPCG01N27/02H01L21/56H01L21/67092H01L21/67155H01L21/67207H01L21/6776H01L21/67778H01L28/20H01L29/6609
Inventor 蒋中英雷一腾肖璐梅李阳
Owner 伊犁师范大学
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