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heating circuit

A heating circuit and heating current technology, applied in the ohmic resistance heating circuit diagram, ohmic resistance heating, electrical components and other directions, can solve the problems of electronic equipment deformation, slow heating of electronic equipment, temperature adjustment and other problems

Active Publication Date: 2021-09-14
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The heating power of the above-mentioned heating circuit is a fixed value and cannot be adjusted according to the temperature. If the heating power continues to be too high, it will cause deformation of the electronic equipment; if the heating power is too small, it will cause the electronic equipment to heat up too slowly.

Method used

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Embodiment Construction

[0023] At present, most electronic devices contain semiconductor devices, such as semiconductor chips, etc. Since semiconductor devices are sensitive to temperature, they cannot work when the temperature is lower than a certain value, which leads to the failure of electronic devices to work normally at low temperatures. In order to improve the low-temperature response capability of the electronic device, it is necessary to use a heating circuit to heat the core working unit of the electronic device, so that the core working unit reaches at least the minimum working temperature of the electronic device. figure 1 Is the structure diagram of the current heating circuit.

[0024] Please refer to figure 1 , the heating circuit includes a temperature signal processing unit, a temperature control unit and a power starting unit, etc. Among them, the temperature signal processing unit includes signal amplification circuit, sensor, reference voltage generation circuit, etc., the temper...

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Abstract

The present application provides a heating circuit, including a temperature sensing unit, a current amplification unit and a heating unit, wherein the temperature sensing unit generates a first voltage negatively related to the temperature according to the temperature of the electronic device, and the current amplification unit generates a first voltage based on the first voltage A heating current is generated, the heating current is amplified and input to the heating unit, and the heating unit generates heating power according to the heating current, and heats the electronic device, so that the temperature of the electronic device reaches at least the minimum temperature at which the electronic device can work. During the heating process, when the temperature of the electronic device is lower, the heating power is greater, and when the temperature of the electronic device is higher, the heating power is smaller. Therefore, the heating circuit can adjust the heating power according to the temperature, thereby Prevent the heating power from being too large or too small. Moreover, the circuit does not use high-cost ICs such as comparators and controllers, but only transistors and resistors, and the cost is low.

Description

technical field [0001] The embodiments of the present application relate to the technical field of electronic device heating, and in particular to a heating circuit. Background technique [0002] With the advent of the 5th Generation (5G), various electronic devices have penetrated into all aspects of people's lives, such as homes, vehicles, and businesses. Moreover, with the development of the Internet of Things (IOT) industry, more and more devices and objects will be implanted into electronic devices in the future, so as to realize intelligent control. Usually, electronic equipment must contain semiconductor devices, and semiconductor devices have temperature-limited characteristics, so it is difficult to ensure that electronic equipment can work normally at low temperatures. For consumer electronic equipment, the semiconductor devices produced by advanced manufacturers in the industry can work above -10°C; for industrial electronic equipment, although the semiconductor ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05B1/02H05B3/00
CPCH05B1/0202H05B3/0019
Inventor 齐义明王永超雷晓鹏
Owner HUAWEI TECH CO LTD