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Modular information processing system and heat dissipation method thereof

A technology of information processing system and heat dissipation method, which is applied in the field of modular information processing system and its heat dissipation, can solve problems such as imperfections, and achieve the effects of reducing power consumption, convenient installation and use, and flexible design

Active Publication Date: 2019-09-24
CHENGDU AEROSPACE COMM EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But no technology is perfect. Due to different application scenarios and design goals, with the increase of processing speed, both general-purpose computers and special-purpose computers are faced with the same problem of how to increase speed, reduce power consumption, reduce volume and improve heat dissipation. And other issues

Method used

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  • Modular information processing system and heat dissipation method thereof
  • Modular information processing system and heat dissipation method thereof
  • Modular information processing system and heat dissipation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Such as figure 1 As shown, this embodiment provides a modular information processing system, including a communication processing subsystem and a trusted computing subsystem, and the communication processing subsystem and the trusted computing subsystem are connected and data exchanged through the Mini COMe bus board. Among them, the communication processing subsystem includes link management and protocol conversion module, communication parameter loading module, Beidou positioning module, 3G module, cable module, ultrashort wave communication module, layer 2 switching module, digital voice processing module, analog voice processing module, human machine interface module, video input module and power supply module, among them, the communication parameter loading module and the digital voice processing module are bidirectionally connected to the link management and protocol conversion module, and the Beidou positioning module, 3G module, wired module and ultrashort wave c...

Embodiment 2

[0023] On the basis of Embodiment 1, this embodiment provides the following system interface design:

[0024] a) Provide a GBLAN interface to connect with the layer-2 switching module, support 10 / 100 / 1000 Mbps high-speed data access, and use to complete the connection of external data of the system;

[0025] b) A SATA interface is provided, and a connector position is reserved on the board for connecting the hard disk;

[0026] c) Provide 8 USB ports, support USB2.0 protocol, including 3 for internal use: 1 built-in USB keyboard, 1 built-in USB touch screen, 1 built-in USB camera, 3 for external use: extended USB mouse, USB keyboard and 1 data interface each;

[0027] d) Provide a LVDS display interface, support 18bit / 24bit, to connect to the display;

[0028] e) Provide a DVI display interface, support DVI-D, and reserve a display interface for connecting the display unit, so as to facilitate human-computer interaction and management;

[0029] f) Provide a PCIe interface, ...

Embodiment 3

[0031] On the basis of Embodiment 1, this embodiment provides the following power supply scheme:

[0032] (1) DC input

[0033] The information processing module is powered by +12V power supply, the communication processing subsystem is directly powered by the power module, and the trusted computing subsystem is input through the COMe connector, which can provide a maximum power of 11.6W. Specifically, the COMe connector may be a TYCO:3-6318490-6 type COMe connector.

[0034] (2) Power control

[0035] The information processing system supports +12V power input through COMe connector pins A104~A109 and B104~B109. And control the power supply through PWRBTN#, PWRBTN#, PWR_OK, BATLOW#, VCC_RTC, VCC_5V_SBY, LVDS Panel PowerControl and SPI_POWER signals.

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Abstract

The invention discloses a modular information processing system and a heat dissipation method thereof. The system comprises a communication processing subsystem and a trusted computing subsystem, wherein the communication processing subsystem and the trusted computing subsystem are connected and perform data interaction through a Mini COMe bus board card; according to the heat dissipation method, fluoride in the heat absorption end of the heat dissipation subsystem absorbs heat of the heating element and then is vaporized into steam; the fluoride flows through a micro channel in the heat conducting plate, heat is transferred to a shell at the heat release end to cool the fluoride, the fluoride becomes liquid after being cooled, the liquid flows back to the heat absorption end, circulation is completed one time, and finally heat consumption is discharged to the outside. The modular design and the COMe bus architecture are adopted, so that the product is more flexible and reliable in design, information such as voice information, time unification information and navigation is successfully processed, and the system has the advantages of being small in size, high in integration level, convenient to install and use, stable in system and the like.

Description

technical field [0001] The invention belongs to the technical field of information processing, and in particular relates to a modular information processing system and a heat dissipation method thereof. Background technique [0002] Today, when information technology is relatively developed, information processing equipment presents a diversified development trend, and has experienced multiple development periods such as manual processing, mechanical information processing, and computer processing. At present, telephone, radio and television have been used, and the core of their processing is the integration of modern computer technology and communication technology. Incomparable advantages of other technologies. But no technology is perfect. Due to different application scenarios and design goals, with the increase of processing speed, both general-purpose computers and special-purpose computers are also faced with how to increase speed, reduce power consumption, reduce vo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 侯贵双牛志强周翠云
Owner CHENGDU AEROSPACE COMM EQUIP CO LTD
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