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A cooling method for a modular information processing system

A technology of information processing system and heat dissipation method, which is applied in the field of heat dissipation of modular information processing systems, can solve problems such as imperfections, and achieve the effects of reducing power consumption, improving heat dissipation capacity, and convenient installation and use

Active Publication Date: 2022-05-24
CHENGDU AEROSPACE COMM EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But no technology is perfect. Due to different application scenarios and design goals, with the increase of processing speed, both general-purpose computers and special-purpose computers are faced with the same problem of how to increase speed, reduce power consumption, reduce volume and improve heat dissipation. And other issues

Method used

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  • A cooling method for a modular information processing system
  • A cooling method for a modular information processing system
  • A cooling method for a modular information processing system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] as Figure 1As shown, the present embodiment provides a modular information processing system, comprising a communication processing subsystem and a trusted computing subsystem, a communication processing subsystem and a trusted computing subsystem through the Mini COMe bus board for connection and data interaction. Among them, the communication processing subsystem includes link management and protocol conversion module, communication parameter loading module, Beidou positioning module, 3G module, wired module, ultra-shortwave communication module, layer two switching module, digital voice processing module, analog voice processing module, human-machine interface module, video input module and power module, wherein, communication parameter loading module and digital voice processing module two-way connection link management and protocol conversion module, Beidou positioning module, 3G module, Wired modules and ultrashort wave communication modules are connected to link mana...

Embodiment 2

[0023] The present embodiment provides the following system interface design on the basis of Example 1:

[0024] a) Provide a GBLAN interface, connected with the Layer 2 switching module, support 10 / 100 / 1000Mbps high-speed data access, used to complete the connection of external data of the system;

[0025] b) Provide a SATA interface, the connector position is reserved on the board for connecting the hard disk;

[0026] c) Provide 8 USB interfaces, support USB2.0 protocol, of which 3 are used internally: 1 built-in USB keyboard, 1 built-in USB touch screen, 1 built-in USB camera, and 3 external uses: 1 extended USB mouse, USB keyboard and 1 data interface;

[0027] d) Provide an LVDS display interface, support 18bit / 24bit, to connect the display;

[0028] e) Provide a DVI display interface, support DVI-D, and reserve the display interface for connecting the display unit to facilitate human-computer interaction and management;

[0029] f) Provides a PCIe interface that supports ×4...

Embodiment 3

[0031] The present embodiment provides the following power supply scheme on the basis of Example 1:

[0032] (1) DC input

[0033] The information processing module is powered by a +12V power supply, the communication processing subsystem is directly powered by the power supply module, and the trusted computing subsystem is input through the COMe connector, which can provide a maximum power of 11.6W. Specifically, the COMe connector can use TYCO: 3-6318490-6 type COMe connector.

[0034] (2) Power control

[0035] The information processing system supports +12V inputs via COMe connector pins A104~A109 and B104~B109. Power supply control is achieved through PWRBTN#, PWRBTN#, PWR_OK, BATLOW#, VCC_RTC, VCC_5V_SBY, LVDS Panel PowerControl and SPI_POWER signals.

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Abstract

The invention discloses a heat dissipation method for a modularized information processing system. The system includes a communication processing subsystem and a trusted computing subsystem. The communication processing subsystem and the trusted computing subsystem are connected and exchange data through a Mini COMe bus board In this heat dissipation method, the fluoride in the heat-absorbing end of the heat dissipation subsystem absorbs the heat of the heating element and then vaporizes into steam, which flows through the micro-channels inside the heat-conducting plate and transfers the heat to the shell of the heat-releasing end to complete the fluoride removal. Cooling, the fluoride turns into a liquid after cooling, and then flows back to the heat-absorbing end to complete a cycle that goes round and round, and finally discharges the heat loss to the outside. The invention adopts modular design and COMe bus architecture, which makes the product more flexible and reliable in design, successfully completes the processing of information such as voice information, time statistics information and navigation, and has the advantages of small size, high integration, easy installation and use Convenience, system stability and other advantages.

Description

Technical field [0001] The present invention belongs to the field of information processing technology, in particular to a heat dissipation method of a modular information processing system. Background [0002] In today's relatively developed information technology, information processing equipment has shown a diversified development trend, and has experienced a number of development periods such as manual processing, mechanical information processing and computer processing. At present, there has been the use of telephone, radio and television, the core of its processing is the integration of modern computer technology and communication technology, this integration is not a simple addition, the computer as the processing core of information, in the information storage, processing and transmission has other technologies have incomparable advantages. But no technology is perfect, due to the different application scenarios and design goals, with the increase of processing speed, wh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 侯贵双牛志强周翠云
Owner CHENGDU AEROSPACE COMM EQUIP CO LTD
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