A kind of LED display glue pouring method

A technology of LED display and glue filling, which is applied in the direction of identification devices, instruments, printed circuits, etc., can solve the problems of inconsistent display ink color, peeling off, and lamp tube falling off, so as to reduce the probability of ion migration, ensure consistency, and prevent Shedding effect

Active Publication Date: 2021-10-22
FUJIAN QIANGLI PHOTOELECTRICITY
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0002] Most of the existing indoor small-pitch LED displays have no protective treatment on the lamp surface. Due to uncertain factors in the installation and use environment, the LED lamp tube pins on the display screen will be oxidized, the lamp tube will fall off, and even the PCB will be damaged. Major quality problems such as stripping of copper clad board and glass fiber cloth, ion migration, and color difference of PCB background color
The existing technology is to add a mask, pour liquid epoxy resin and inkjet on the lamp surface of the LED module for protection or to solve the ink color consistency of the PCB board. When the gap between the LED packages is less than 0.2mm, the process technology, equipment accuracy, Manufacturing costs, product quality, etc. are difficult to meet the requirements of mass production

Method used

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  • A kind of LED display glue pouring method
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Embodiment Construction

[0017] In the claims and description, unless otherwise defined, terms such as "first", "second" or "third" are used to distinguish different objects, rather than to describe a specific sequence.

[0018] In the claims and specification, unless otherwise defined, the terms "central", "transverse", "longitudinal", "horizontal", "vertical", "top", "bottom", "inner", "outer", " The orientation or positional relationship indicated by "Up", "Down", "Front", "Back", "Left", "Right", "Clockwise", "Counterclockwise" etc. are based on the orientation and positional relationship shown in the drawings , and are only for the convenience of simplifying the description, and do not imply that the referred device or element must have a specific orientation or be constructed and operated in a specific orientation.

[0019] In the claims and description, unless otherwise defined, the term "fixed connection" or "fixed connection" should be understood in a broad sense, that is, any connection meth...

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PUM

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Abstract

A glue filling method for LED display screens has been disclosed. The LED display screen includes light boards and packages arranged at intervals on the light boards in a matrix; Lay solid packaging strips layer by layer in the gap between the bodies; then surround the LED display with baffles and bake them to melt the solid packaging strips and then cool them down. Using the above-mentioned technical scheme, the adhesive strip undergoes a solid-liquid-solid conversion, and is wrapped around each LED lamp package to form a solid protective wall, which not only protects the lamp pins from oxidation, but also reinforces the The adhesion of the LED light tube on the PCB prevents the LED light tube from falling off due to external force and reduces the probability of ion migration. At the same time, it also blocks the difference in the background color between the PCB and the PCB board, ensuring the consistency of the ink color of the product.

Description

technical field [0001] The invention relates to the field of LED display manufacturing, in particular to a glue filling method for an LED display. Background technique [0002] Most of the existing indoor small-pitch LED displays have no protective treatment on the lamp surface. Due to uncertain factors in the installation and use environment, the LED lamp tube pins on the display screen will be oxidized, the lamp tube will fall off, and even the PCB will be damaged. There are major quality problems such as stripping of copper clad on the board circuit and glass fiber cloth, ion migration, and inconsistent display ink color caused by the color difference of the PCB background. The existing technology is to add a mask, pour liquid epoxy resin and inkjet on the lamp surface of the LED module for protection or to solve the ink color consistency of the PCB board. When the gap between the LED packages is less than 0.2mm, the process technology, equipment accuracy, Manufacturing ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G09F9/33H05K3/28
CPCG09F9/33H05K3/284
Inventor 周宗徐惠能钟如春何国经
Owner FUJIAN QIANGLI PHOTOELECTRICITY
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