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An integrated packaging structure for dual motor controllers

An integrated packaging and controller technology, applied in the direction of controlling multiple AC motors, output power conversion devices, and transforming equipment structural components, etc., can solve the problems of low space utilization of the whole machine, complex internal connections, and many connecting devices , to achieve the effect of improving space utilization and integration, improving heat dissipation efficiency, and reducing heat dissipation thermal resistance

Active Publication Date: 2022-04-01
HEFEI JUYI POWER SYST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Currently, the power modules, film capacitors, and current sensors used in the controller are scattered and arranged inside the controller. Many devices and complex structure

Method used

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  • An integrated packaging structure for dual motor controllers
  • An integrated packaging structure for dual motor controllers
  • An integrated packaging structure for dual motor controllers

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Embodiment Construction

[0023] Such as figure 2 As shown, the integrated packaging structure of the dual-motor controller of the present invention includes a water-cooled plate 1, a power module 2, a film capacitor 3, a Boost inductor group 4, a three-phase current sensor 5, a relay 6, a potting box 7 and a connecting copper bar 8. The power module 2 and the three-phase current sensor 5 are fixed on one side of the water-cooled plate 1, and the film capacitor 3, Boost inductor group 4 and relay 6 are arranged on the other side; the potting box 7 is fixedly connected to the water-cooled plate 1 to form a potting The glue cavity, the film capacitor 3 and the Boost inductor group 4 are sealed and fixed in the glue cavity.

[0024] Such as image 3 As shown, the power module 2 includes a Boost converter unit 201 , a generator controller unit 202 and a motor controller unit 203 , and the wafer components of each unit of the power module 2 are welded to the water cooling plate 1 . The electrodes of the ...

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Abstract

The invention discloses an integrated packaging structure of a dual-motor controller, including a water-cooled plate, a power module, a film capacitor, a Boost inductance group, a three-phase current sensor, a relay, and a potting box; one side of the water-cooled plate is fixed with a power module and The three-phase current sensor, the potting box on the other side is fixedly connected with the water-cooled plate to form a potting cavity, and the film capacitor and Boost inductor group are potted and fixed into the potting cavity. The power module includes a Boost converter unit, a generator controller unit and a motor controller unit, and the wafer components of each unit of the power module are welded to the water cooling plate. The electrical connection is realized through connecting copper bars inside the integrated packaging structure. The solution of the present invention integrates the two power module units of the dual motor controller, the Boost converter unit, the water cooling plate, the film capacitor, the Boost inductor, the three-phase current sensor and other devices, which is beneficial to the rational use of space, improving space utilization and integration The degree greatly reduces the packaging volume of the module.

Description

technical field [0001] The invention relates to a dual-motor controller, in particular to an integrated package structure of a dual-motor controller. Background technique [0002] Currently, the power modules, film capacitors, and current sensors used in the controller are scattered and arranged inside the controller. There are many devices and the structure is complex. Contents of the invention [0003] The object of the present invention is to provide an integrated packaging structure of a dual motor controller, which integrates the two power module units and the BOOST converter module unit of the dual motor controller, and reduces the packaging volume of the module. [0004] Technical scheme of the present invention is: [0005] An integrated packaging structure of a dual-motor controller, including a water cooling plate, a power module, a film capacitor, a Boost inductance group, a three-phase current sensor, a relay, and a potting box; the power module and the three...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02P5/74H02M7/00H05K7/20
CPCH02P5/74H02M7/003H05K7/20927
Inventor 王淑旺范佳伦毛建华刘峰程勇张红玉班建安孙纯哲
Owner HEFEI JUYI POWER SYST CO LTD
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