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A heat dissipation device for a multi-layer circuit board

A multi-layer circuit board and heat dissipation device technology, which is applied to circuit heating devices, printed circuit components, electrical components, etc., can solve problems affecting the use effect of electronic products, traditional multi-layer circuit boards, unfavorable circuit board heat dissipation, etc., to achieve Realize heat loss, avoid heat accumulation and prolong service life

Active Publication Date: 2022-05-20
广州市信宏洗衣机械有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

To sum up, the existing technology has the following defects: the design and installation of multilayer circuit boards is relatively traditional, which is not conducive to the heat dissipation between circuit boards, thus affecting the use effect of electronic products

Method used

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  • A heat dissipation device for a multi-layer circuit board

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Comparison scheme
Effect test

Embodiment

[0019] This embodiment provides a heat dissipation device for a multi-layer circuit board, which includes a plurality of circuit board bodies 10 with the same specifications, and a plurality of electronic chips 11 are arranged on the circuit board body 10, and also includes a plurality of heat dissipation rods 20 and at least one The heat sink 30, the circuit board body 10 is stacked in parallel in order to form a multi-layer circuit board according to the same orientation of the electronic chips 11 arranged on the surface, and the multi-layer circuit board has an outward facing electronic chip 11 on the side of the circuit board body 10 A heat sink 30 is provided; one end of the heat dissipation rod 20 is attached to the electronic chip 11 , and the other end passes through the rear heat sink body in turn until the heat sink 30 , so as to rapidly dissipate heat from the electronic chip 11 .

[0020] Further, the circuit board body 10 includes a first circuit board body 10 fart...

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Abstract

The invention discloses a heat dissipation device for a multi-layer circuit board, which comprises a plurality of circuit board bodies with the same specification, and a plurality of electronic chips are arranged on the circuit board body, and a plurality of heat dissipation rods and at least one heat sink are also included. One end of the cooling rod is pasted on the electronic chip, and the other end passes through the multi-layer circuit board until the heat sink. The invention can quickly and effectively conduct the heat generated by the electronic chip on the multi-layer circuit board, realize heat loss, avoid heat accumulation, and prolong the service life of the circuit board components.

Description

technical field [0001] The invention relates to the field of circuit board heat dissipation, in particular to a heat dissipation device for a multilayer circuit board. Background technique [0002] In electronic system products, generally known printed circuit boards are used to carry electronic components, usually using a flat substrate composed of glass fiber cloth or a soft substrate, and then printing a conductive layer on the substrate, or forming a circuit on the substrate After that, multiple circuit layers and insulation layers are laminated by gluing the work clothes, and processed to complete the production of multilayer printed circuit boards. As electronic products move towards the design concept of "thin, thin and small", printed circuit boards are also developing in the direction of small aperture, high density, multi-layer, and thin lines. Among them, multi-layer circuit board is a good solution to increase circuit density. [0003] However, the thermal cond...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K7/20
CPCH05K1/0204H05K7/205H05K7/2039
Inventor 肖华肖泽斌
Owner 广州市信宏洗衣机械有限公司
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