A crystal-bonding structure for semiconductor production

Abstract

The invention discloses a crystal-fixing structure for semiconductor production. Both the base and the working box are cuboid structures, the length of the base and the working box are consistent, and the width of the working box is half of the width of the base. The working box is fixed Set up on the surface of the base, the surface of the base is fixed with a turntable, and the two sides of the turntable are symmetrically equipped with clamping blocks, and the front of the working box is provided with a rectangular slot, half of the turntable A part of the turntable is set inside the work box through the rectangular slot, and the other half of the turntable is set outside the work box through the rectangular slot. By setting two clamping blocks symmetrically on the surface of the turntable, when the operator loads one side When the clamping block is clamped, the semiconductor crystal bonding process is completed on the clamping block on the other side to improve the production efficiency of the semiconductor crystal bonding process. The clamping block is fixed on the heating plate, and the clamping block is completed by the heating plate for synchronous heating, so that Semiconductor die-bonding processing quality is good.

Description

Technical field [0001] The present invention belongs to the technical field of electronic components, in particular a solid crystal structure for semiconductor production. Background technique [0002] The LED chip is a solid-state semiconductor device that converts electrical energy into light directly. LED is a semiconductor wafer, and one end of the wafer is attached to a bracket, one end is a negative electrode, one end is the positive electrode of the power supply, so that the entire wafer is encapsulated by an epoxy resin. [0003] With the maturity of LED technology, the use of LEDs in people's daily lives is also broader, and generally crystallized LED enclosed processes include solid crystal blocks, dispensing, long bakes, etc., wherein the solid crystal block processes include coating. , Patch and heating steps, the prior art solid crystal block machine includes a machine, a coating unit, and a patch unit, and a corresponding substrate placed structure on the machine, t...

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Problems solved by technology

[0004] For example, the patent application number (CN201320089005.7) discloses an LED crystal-bonding structure, which provides an LED crystal-bonding structure that is not only suitable for sheet-shaped LED brackets, but also for strip-shaped or full-volume LED brackets. The die-bonding structure can realize the automatic operation of the entire production process, and the efficiency is high, but the existing LED semiconductor die-bonding structure is complex in design, and has the following deficiencies:

[0005] 1. The design of the existing semiconductor die-bonding structure is relatively complicated, which is not convenient for fixed installation, and the short distance between the positive and negative electrodes is likely to be affected. At the same time, the existing die-bonding swing arm has a short movable distance, which is not conducive to different semiconductor die-bonding processes. have great limitations;

[0006] 2. The existing semiconductor crystal-bonding structure has a poor heating effect on solder paste. When the semiconductor is in contact with the solder paste, it needs to be taken out and heated and baked. The operation is complicated, resulting in poor semiconductor crystal-bonding effect and reducing the use of semiconductors. number of years;

[0007] 3. In the process of fixing the semiconductor by the existing semiconductor crystal-bonding structure, the semiconductor is usually solidified by a single clamping block, resulting in low production efficiency of the semiconductor crystal-bonding process;

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