Liquid-cooled cold plate device

Abstract

The invention provides a liquid-cooled cold plate device. The liquid-cooled cold plate device comprises a micro-channel cold plate, at least two micro-channel groups, at least one liquid inlet and atleast one liquid outlet, wherein the micro-channel cold plate is used for dissipating heat of an electronic system, the at least two micro-channel groups are arranged inside the micro-channel cold plate; the at least one liquid inlet is formed in the micro-channel cold plate and is used for allowing a cooling liquid to flow in; the at least one liquid outlet is arranged on the micro-channel cold plate and is used for allowing the cooling liquid to flow out; the cooling liquid entering the liquid inlet is divided into one cooling liquid branch; and the cooling liquid branch flows back and forththrough the micro-channel group. The micro-channel cold plate is combined with the micro-channel groups, so that the heat dissipation efficiency is greatly improved, the front-back heat cascade influence is reduced, and the efficient heat dissipation of the electric system is realized.

Description

technical field [0001] The invention belongs to the technical field of refrigeration, and relates to a cooling device, in particular to a liquid-cooled cold plate device. Background technique [0002] With the development of electronic technology and the improvement of chip technology, the volume of electronic components is getting smaller and smaller, and the heat emitted per unit volume is also increasing. In order to maintain the normal working condition of electronic components, a good heat dissipation device is essential. At present, mainstream servers mainly rely on forced air cooling to dissipate heat for internal high-power consumption and high-temperature components. However, as the power consumption of electronic components continues to increase, the traditional forced air cooling method can no longer meet the heat dissipation specifications of high heat flux density servers. As a novel heat dissipation solution, liquid cooling technology has gradually become popu...

AI Technical Summary

Problems solved by technology

At present, mainstream servers mainly rely on forced air cooling to dissipate heat for internal high-power consumption and high-temperature components. However, as the power consumption of electronic components continues to increase, the traditional forced air cooling method can no longer meet the heat dissipation specifications of high heat flux density servers. As a novel heat dissipation solution, liquid cooling technology has gradually become popular in electronic systems and other applications and reflects its high efficiency and economical characteristics.

However, there are often multiple heat sources in electronic systems, and the existing liquid cooling devices do not consider the thermal cascade problem among multiple heat sources in the heat dissipation process. On the other hand, it will also lead to temperature imbalance between different electronic components, which will greatly affect the performance of the entire system.

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