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Polishing solution polishing particle circularly extracting device

A technology of polishing particles and circular extraction, which is applied in the direction of grinding/polishing equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of increased production cost, reduced processing efficiency, and reduced surface quality, and achieves high atomization ratio and fog Good effect of chemicalization and cost reduction

Active Publication Date: 2019-10-25
NORTHEASTERN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the polishing liquid is not replaced in time, the exfoliated workpiece particles mixed in the polishing liquid will enter the scratches of the polishing particles on the surface of the workpiece when micro-cutting, weakening the cutting effect of the polishing particles and reducing the processing efficiency. Scratches on the polishing surface or uneven polishing removal degree caused by agglomeration or uneven dispersion of polishing particles
Although this kind of phenomenon can be eliminated in the subsequent polishing process, it greatly increases the polishing time and the amount of polishing liquid used, which increases the production cost of the product and reduces the overall surface quality

Method used

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  • Polishing solution polishing particle circularly extracting device
  • Polishing solution polishing particle circularly extracting device
  • Polishing solution polishing particle circularly extracting device

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Embodiment Construction

[0034] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0035] Such as Figure 1-Figure 4 As shown, a polishing liquid polishing particle circulation extraction device includes a casing 1 and a polishing liquid reservoir 2 arranged inside the casing, a polishing liquid ultrasonic atomization device 3, a polishing liquid drying device 4, and a polishing particle With air flow mixing device 5 and p...

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Abstract

The invention discloses a polishing solution polishing particle circularly extracting device which comprises a box body as well as a polishing solution storage device, a polishing solution ultrasonicatomization device, a polishing solution drying device, a polishing particle and airflow mixing device, and a polishing particle separating device all arranged in the box body, wherein a polishing solution stirring device is arranged in the polishing solution storage device; and polishing waste solution is collected and stirred in the polishing solution storage device, is atomized in the polishingsolution ultrasonic atomization device, enters the polishing solution drying device to be dried, then enters the polishing particle and airflow mixing device, and finally enters the polishing particle separating device, so that separation of particles with different masses is realized according to different gravity ranges of different particles. The polishing solution polishing particle circularly extracting device can recycle the polishing solution after polishing treatment to greatly lower the economic cost of the polishing process and increase the green manufacturing degree of the polishing process.

Description

technical field [0001] The invention relates to a polishing particle extraction device, in particular to a polishing liquid polishing particle circulation extraction device. Background technique [0002] At present, with the development of science and technology and the upgrading of the industry chain, the processing standards in various fields of society continue to rise, and the demand for smooth or ultra-smooth surface components is increasing. In the standard of the optical field, the surface accuracy of the complex curved surface element is required to be within a few tenths of a wavelength, and its surface roughness is required to be below 5 nanometers. It is an important research direction to control the factors that affect the polishing quality in each link during the polishing process, so as to improve the precision of the polished workpiece surface and reduce the surface roughness. However, during the polishing process, the core material polishing liquid requires ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B57/00
CPCB24B57/00
Inventor 孟凡伟于涛张天琪陈辽原张超张海洋于天彪赵继
Owner NORTHEASTERN UNIV
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