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A kind of polishing liquid polishing particle circulating extraction device

A technology of polishing particles and circular extraction, which is applied in the direction of grinding/polishing equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of reducing processing efficiency, increasing production cost, and reducing surface quality, and achieves good atomization effect and fog The effect of high conversion ratio and loss prevention

Active Publication Date: 2021-12-07
NORTHEASTERN UNIV LIAONING
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the polishing liquid is not replaced in time, the exfoliated workpiece particles mixed in the polishing liquid will enter the scratches of the polishing particles on the surface of the workpiece when micro-cutting, weakening the cutting effect of the polishing particles and reducing the processing efficiency. Scratches on the polishing surface or uneven polishing removal degree caused by agglomeration or uneven dispersion of polishing particles
Although this kind of phenomenon can be eliminated in the subsequent polishing process, it greatly increases the polishing time and the amount of polishing liquid used, which increases the production cost of the product and reduces the overall surface quality

Method used

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  • A kind of polishing liquid polishing particle circulating extraction device
  • A kind of polishing liquid polishing particle circulating extraction device
  • A kind of polishing liquid polishing particle circulating extraction device

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Embodiment Construction

[0034] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0035] Such as Figure 1-Figure 4 As shown, a polishing liquid polishing particle circulation extraction device includes a casing 1 and a polishing liquid reservoir 2 arranged inside the casing, a polishing liquid ultrasonic atomization device 3, a polishing liquid drying device 4, and a polishing particle With air flow mixing device 5 and p...

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Abstract

The invention discloses a polishing liquid polishing particle circulation extraction device, which comprises a box body, a polishing liquid liquid storage device arranged inside the box body, a polishing liquid ultrasonic atomization device, a polishing liquid drying device, and a polishing particle mixed with an air flow device and polishing particle separation device; the polishing liquid reservoir is provided with a polishing liquid stirring device. The polishing waste liquid is collected and stirred in the polishing liquid reservoir, atomized in the polishing liquid ultrasonic atomization device, and then enters the polishing liquid drying device. After drying, it enters the polishing particle and air flow mixing device, and then enters the polishing The particle separation device realizes the separation of particles of different qualities according to the different gravity ranges of different particle devices. The polishing liquid polishing particle recycling extraction device described in the present invention is a device capable of recycling the polishing liquid after polishing, which greatly reduces the economic cost in the polishing process and improves the green manufacturing degree of the polishing process.

Description

technical field [0001] The invention relates to a polishing particle extraction device, in particular to a polishing liquid polishing particle circulation extraction device. Background technique [0002] At present, with the development of science and technology and the upgrading of the industry chain, the processing standards in various fields of society continue to rise, and the demand for smooth or ultra-smooth surface components is increasing. In the standard of the optical field, the surface accuracy of the complex curved surface element is required to be within a few tenths of a wavelength, and its surface roughness is required to be below 5 nanometers. It is an important research direction to control the factors that affect the polishing quality in each link during the polishing process, so as to improve the precision of the polished workpiece surface and reduce the surface roughness. However, during the polishing process, the core material polishing liquid requires ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B57/00
CPCB24B57/00
Inventor 孟凡伟于涛张天琪陈辽原张超张海洋于天彪赵继
Owner NORTHEASTERN UNIV LIAONING
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