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Semiconductor laser capable of efficiently dissipating heat

A laser and semiconductor technology, applied in semiconductor lasers, lasers, laser components, etc., can solve problems such as short circuit of electronic devices, hot laser diodes, poor heat dissipation, etc., to ensure normal operation, avoid circuit short circuits, and ensure effective heat dissipation Effect

Inactive Publication Date: 2019-10-25
泉州台商投资区嘉尚网络科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Due to the small size of the laser diode, the heat generated by its work is transferred quickly, which easily makes the entire laser diode hot, and the laser diode is installed inside the device to make the heat dissipation effect worse. The existing semiconductor laser passes through the device. A heat dissipation fan is installed on the casing of the device, and the fan blows air to the inside of the device to achieve the purpose of rapid heat dissipation, but in rainy weather or when the water is overturned, the water droplets will enter the device through the wind generated by the fan rotation, causing the electronic device to short circuit. And there are security risks

Method used

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  • Semiconductor laser capable of efficiently dissipating heat
  • Semiconductor laser capable of efficiently dissipating heat
  • Semiconductor laser capable of efficiently dissipating heat

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Embodiment

[0025] see Figure 1-Figure 7 , the present invention provides a high-efficiency heat dissipation semiconductor laser, its structure includes a laser 1, a heat dissipation device 2, a connecting column 3, a mechanical arm 4, and a base 5, the laser 1 is connected to the heat dissipation device 2, and the heat dissipation device 2 will Covered by the laser 1, the laser 1 is connected to the connecting column 3, the connecting column 3 is mechanically connected to the mechanical arm 4, and the end of the mechanical arm 4 away from the connecting column 3 is connected to the base 5;

[0026] The heat dissipation device 2 is composed of a heat dissipation mechanism a, an exhaust structure b, a laser installation groove c, an air outlet structure d, and an annular wall e. The heat dissipation mechanism a is mechanically connected to the exhaust structure b, and the exhaust structure b is installed on The inner side of the annular wall e, the annular wall e is the inner wall layer o...

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Abstract

The invention discloses a semiconductor laser capable of efficiently dissipating heat. The semiconductor laser structurally comprises a laser, a heat dissipation device, a connecting column, a mechanical arm and a base. The semiconductor laser is coated with the heat dissipation device, and the laser is connected with the connecting column; the end, away from the connecting column, of the mechanical arm is connected with the base. The invention has the beneficial effects that an air bag is filled with heat generated when the laser works through the connecting port, and a movable suction blockand a fixed suction block are pushed to be separated through the expansion of the air bag, so that the fixed block drives a rubber cotton block to be separated from an opening, the opening is opened and the heat is discharged outwards; hot air is guided in and accumulated through vent holes, so that the accumulated hot air pushes one end of a hollow cavity of a movable plate to be separated from one end of a solid cavity of a fixed plate, thereby achieving the purpose of air dissipation; the heat dissipation device of the laser in a normal state is in a closed state, so the water drops can beprevented from entering the laser through wind power generated by the rotation of a fan, thereby guaranteeing the normal work and effective heat dissipation of the laser.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a highly efficient heat dissipation semiconductor laser. Background technique [0002] Laser diodes are light in weight and small in size, and are easy to install on various devices. Because they are widely used, the service life of the device is related to its quality. In addition, the high temperature generated during the operation of the device will affect the performance of the device itself. Therefore, it is necessary to dissipate heat during use. The current heat dissipation semiconductor laser has the following defects: [0003] Due to the small size of the laser diode, the heat generated by its work is transferred quickly, which easily makes the entire laser diode hot, and the laser diode is installed inside the device to make the heat dissipation effect worse. The existing semiconductor laser passes through the device. A heat dissipation fan is installed on the casing of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/024
CPCH01S5/02469
Inventor 潘展成刘宝如江明玲谢志坚
Owner 泉州台商投资区嘉尚网络科技有限公司
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