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Packaging structure

A technology of encapsulation structure and electrical stubs, which is applied to the structural form of radiation elements, antennas, electrical components, etc., can solve the problems of unrealizable structure and mutual interference of feeder stubs, and achieve increased application range, high gain, improved bandwidth and buff effect

Active Publication Date: 2019-11-01
HUAWEI TECH CO LTD
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Problems solved by technology

The traditional single-polarization slot-coupled antenna has the advantages of wide bandwidth and high gain. It includes a parasitic patch, a feed stub and a slot. The feed stub is mainly used to couple and feed various types of slots. To achieve dual The packaging of polarized antennas needs to be realized by using the same-layer feeding method for single-polarized slot-coupled antennas. However, in this method, the feeding branches will interfere with each other, and it is impossible to achieve structurally.

Method used

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Embodiment Construction

[0046] This application provides a package structure and antenna array, which can realize wide bandwidth and high gain, have high polarization isolation, simple structure, small size, can be applied to full-duplex communication systems, and can also be used as multiple input and output ( Multipie input and Multiple Output, MIMO) antenna, and any other possible application scenarios.

[0047] In order to realize a package structure with wide bandwidth and high gain, the present application provides a package structure, including a first radiating plate, a second radiating plate and a feeder, by setting a ring-shaped slit on the second radiating plate, and setting the The feeding part below the second radiating plate, the feeding part includes a first feeding branch and a second feeding branch independently arranged, and the two feeding branches are electromagnetically coupled with the gap to feed the first radiating board , where the setting of the ring-shaped slit and the firs...

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Abstract

The invention provides a packaging structure, which comprises a first radiant panel, a second radiant panel and a feed portion, wherein the second radiant panel is disposed below the first radiant panel; the second radiant panel is provided thereon with an annular slit; the feed portion is disposed below the second radiant panel and comprises a first feed branch and a second feed branch which arearranged independently from each other; and the first feed branch and the second feed branch are disposed perpendicularly to each other on a substrate below the slit and feed the first radiant panel by means of the slit. Thus, the packaging structure having a wide bandwidth and high gains can be achieved.

Description

technical field [0001] The present application relates to an antenna, and in particular to a packaging structure. Background technique [0002] Antenna-in-package is a technology that integrates antennas and chips into packages based on packaging materials and processes to realize system-level wireless functions. Packaged antennas provide a good solution for system-level antenna chips because they take into account antenna performance, cost, and volume. Therefore, it is favored by the majority of chip and packaging manufacturers, and has also become an important antenna solution for the 5th Generation mobile communication technology (5G) millimeter wave mobile communication system. [0003] The packaged dual-polarized antenna array can realize parallel dual-polarized operation, can form two beams, support beam scanning with sufficient precision, and can maintain the transmission and reception modes at the same time, thereby doubling the number of users served. The tradition...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L23/58
CPCH01L23/3114H01L23/58H01Q1/2283H01Q9/0457H01Q1/36H01Q13/10
Inventor 曲恒常明董海林李信宏刘亮胜尹红成
Owner HUAWEI TECH CO LTD
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