Method for improving uniformity of plating surface of PCB pattern

Abstract

The invention discloses a method for improving the uniformity of plating surface of a PCB pattern. The method comprises the steps of: the step 1, placing a developed substrate into a jig and transferring the jig to a pretreatment device; the step 2, vacuuming the pretreatment device; the step 3, performing plasma treatment of the pretreatment device; the step 4, transferring the jig to a jig disengaging device to separate the substrate from the jig; the step 5, vertically installing the substrate on a hanging tool, and arranging an auxiliary cathode at the edge of the PCB substrate; the step 6, putting the substrate into a 10% of sulfuric acid for 7 min; the step 7, configuring a copper plating solution, putting the copper plating solution into a copper plating bath, and immersing the substrate into the copper plating bath for copper plating; the step 8, removing the substrate from the copper plating bath, and performing four-level water washing; and the step 9, completing plating. Themethod provided by the invention can form thick copper layers with uniform thickness in the board surface and the laser hole.

Description

technical field [0001] The invention relates to the technical field of PCB, in particular to a method for improving the uniformity of the electroplating surface of a PCB pattern. Background technique [0002] PCB pattern electroplating is to use the method of electroplating to thicken the copper layer on the board surface and in the hole, and make the laser hole completely filled with copper to form an interlayer conductor. The existing graphic electroplating process has the following deficiencies due to the unreasonable process method: [0003] (1) There is no special transfer fixture, so that the substrate graphics are directly in contact with the equipment, resulting in foreign matter sticking to the substrate, resulting in disconnection, gaps and blocked holes; [0004] (2) There is no plasma treatment, so that the surface of the seed copper layer and the copper protection dry film are not in sufficient contact with the chemical solution, resulting in uneven copper plat...

AI Technical Summary

Problems solved by technology

[0003](1) There is no special transfer fixture, so that the substrate graphics are directly in contact with the equipment, resulting in foreign matter sticking to the substrate, resulting in disconnection, gaps and hole plugging;

[0004](2) There is no plasma treatment, so that the surface of the seed copper layer and copper protection dry film is not in sufficient contact with the chemical solution, resulting in uneven copper plating and disconnection;

[0005](3) There is no auxiliary cathode or the setting is unreasonable, resulting in uneven plating thickness at the center and periphery of the substrate, or burrs on the edge of the substrate;

[0006](4) The spray device in the copper plating tank is unreasonably set up, resulting in the laser hole not being filled or a depression;

[0007](5) Unreasonable setting of additive composition and concentration in copper plating solution, resulting in rough copper plating, laser hole depression and uneven board surface

Images