Explosive foil overpressure chip and detonation device integrated with microfoil switch
A technology of detonating device and detonating foil, which is applied in blasting barrels, offensive equipment, weapon accessories, etc., can solve the problems of insensitive explosives that cannot be directly detonated, low efficiency, and high price, and achieve standardized mass production, reduced process flow, and low cost Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0057] An explosive foil overpressure chip with integrated microfoil switch, such as figure 1 , figure 2 shown. The chip includes a ceramic substrate 1, a metal TiW / Cu layer 2, a Parylene C layer 3, an upper electrode TiW / Cu / Au4, and an Su8 acceleration chamber 5; the ceramic substrate 1 is provided with a metal TiW / Cu layer 2; the metal The TiW / Cu layer 2 is further divided into the lower electrode area 6, the explosive foil array area 7 and the main circuit high-voltage pad area 8, wherein the lower electrode area 6 and the main circuit high-voltage pad area 8 are rectangular structures, respectively located in the explosive foil array The left and right sides of the area 7 are connected to it; the explosion foil array area 7 is a circular structure, which is divided into an explosion foil 7-1, a transition area 7-2 and a connection area 7-3, wherein the explosion foil 7 -1 is the narrowest part in the explosion foil array area 7, there are four, the connection mode is th...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


