Vacuum high-low temperature semiconductor device test probe station and semiconductor device test method

Abstract

The invention relates to a vacuum high-low temperature semiconductor device test probe station comprising a vacuum cavity, an anti-radiation screen, a sample station and a probe arm; the vacuum cavityis used for forming a sealed test environment; the anti-radiation screen is used for blocking radiation of the outside to the sample station and is located in the vacuum cavity; the sample station isused for containing a sample and located in the anti-radiation screen; the probe arm comprises a probe needle rod and a probe located at the tail end of the probe needle rod; and the probe needle rodpenetrates through the vacuum cavity and the anti-radiation screen, so that the probe stretches into the position where the sample is located so as to conduct point needling. The invention further discloses a semiconductor device test method. The vacuum high-low temperature semiconductor device test probe station as mentioned above is used. According to the vacuum high-low temperature semiconductor device test probe station and the semiconductor device test method provided by the invention, the structures such as the vacuum cavity, the anti-radiation screen and the like are arranged, so thata test environment integrated with high temperature, low temperature, vacuum and the like can be effectively created, and a stable test environment can be provided for the produced semiconductor device.

Description

technical field [0001] The invention relates to the technical field of semiconductor device testing, in particular to a vacuum high-low temperature semiconductor device testing probe station and a semiconductor device testing method. Background technique [0002] With the development of aerospace technology, some highly reliable and high-performance semiconductor devices, especially core aerospace devices, have become an important symbol to measure the level of a country's aerospace technology. However, due to the weak foundation of my country's integrated circuit industry, key semiconductor devices mainly rely on imports. Not only are the costs high and the import channels have no quality assurance, but there are also great security risks, such as chips being implanted in Trojan horse structures. To this end, it is necessary to have core devices developed by itself. [0003] However, in every research and development process, in order to ensure that the device can withstan...

AI Technical Summary

Problems solved by technology

However, due to the weak foundation of my country's integrated circuit industry, key semiconductor devices mainly rely on imports. Not only are the costs high and the import channels have no quality assurance, but there are also great security risks, such as chips being implanted in Trojan horse structures, etc.

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