Microcontroller unit

Abstract

The invention discloses a microcontroller unit, which comprises a 3D nonvolatile memory array, and the microcontroller unit and the 3D nonvolatile memory unit are integrated on the same silicon substrate. The microcontroller unit is implemented under the 3D non-volatile memory array, or the microcontroller unit is implemented on the side surface of the 3D non-volatile memory array. Part or all ofthe storage units in the micro-control unit are composed of a 3D nonvolatile storage array. The microcontroller unit is used for reading data stored in the 3D nonvolatile storage array for processing,and the processing comprises operations such as machine learning and / or query and / or deduplication. According to the microcontroller unit structure provided by the invention, on one hand, the problemthat a traditional microcontroller is relatively small in storage capacity can be solved; and on the other hand, the defect that a large-capacity memory cannot be applied to the Internet of Things isovercome, so that the structure provided by the invention can be applied to calculation, machine learning and the like of Internet of Things nodes.

Description

technical field [0001] The invention relates to the field of micro-control units, in particular to a micro-control unit integrated with 3D memory, which is used in AI application scenarios in the Internet of Things. Background technique [0002] The microcontroller unit (MCU) is mainly used in embedded systems and the Internet of Things, and its specific architecture is shown in the attached figure 1 As shown, it specifically includes a processing unit 1_1 , a storage unit 1_2 , a communication module 1_3 and an A / D conversion module 1_4 , and the storage unit is generally an embedded memory, such as an embedded flash memory. Due to less data to be processed and stored in a traditional MCU, the capacity of the storage unit is relatively small, generally at the KB or MB level. With the gradual development of the information and intelligent era, the sensor nodes of the Internet of Things need to store more and more information. At the same time, it is more and more urgent to ...

AI Technical Summary

Problems solved by technology

[0003] The current large-capacity memory is generally a stand-alone memory, such as NAND flash memory, whose capacity is generally at the GB level. Especially with the development of 3D-NAND technology, the number of stacked layers is increasing and the capacity is increasing. However, the current Large-capacity stand-alone memory cannot be directly used for IoT nodes to store data. Although the current large-capacity stand-alone memory also has a controller, its function is relatively simple, and it is only used for reading and writing array data and corresponding erase operation

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