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Display panel and manufacturing method thereof

A technology for display panels and manufacturing methods, which is applied to semiconductor devices, electrical components, circuits, etc., can solve problems such as high difficulty, lower production yield of display panels, difficult color display of display panels, etc., and achieve the effect of improving utilization rate

Active Publication Date: 2021-11-12
CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the laser lift-off of the light-emitting chip and the welding process of the light-emitting chip and the backplane will greatly reduce the production yield of the display panel, and for the display panel using silicon-based microdisplay technology, the light-emitting chip can achieve high alignment accuracy The welding technology is extremely difficult, which further reduces the production yield of the display panel, and it is difficult to use the traditional quantum dot color conversion technology to realize the color display of the display panel

Method used

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  • Display panel and manufacturing method thereof
  • Display panel and manufacturing method thereof
  • Display panel and manufacturing method thereof

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Embodiment Construction

[0046] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures. Throughout this specification, the same or similar reference numerals represent the same or similar structures, elements or processes. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0047] figure 1 It is a schematic cross-sectional structure diagram of a display panel provided by an embodiment of the present invention, figure 2 It is a schematic top view structural diagram of a display panel pro...

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Abstract

The invention discloses a display panel and a manufacturing method thereof. The display panel includes a substrate and a plurality of first light-emitting devices, a plurality of second light-emitting devices and a plurality of third light-emitting devices located on the substrate. The first light-emitting devices, The emission colors of the second light emitting device and the third light emitting device are different; the first light emitting device and the second light emitting device are epitaxially grown on the substrate, and the third light emitting device is bonded on the substrate. Through the technical solution of the present invention, the influence of the laser lift-off process and the bonding process on the production yield of the display panel is reduced, the difficulty of bonding alignment during mass transfer is reduced, and the color display panel, especially the micro display panel, is realized. displayed.

Description

technical field [0001] Embodiments of the present invention relate to the field of display technology, and in particular to a display panel and a manufacturing method thereof. Background technique [0002] Silicon-based microdisplay technology is about combining display with monocrystalline silicon integrated circuits. The display panel using silicon-based microdisplay technology has the advantages of high display resolution, large viewing angle, fast response speed, high brightness and low power consumption, which makes silicon Silicon-based microdisplay technology has broad application prospects in increasing image display size and definition, reducing the number of system chips to reduce system cost and product space volume. At present, silicon-based microdisplay technology can be used in military, medical, aerospace and Consumer electronics and other fields. [0003] However, the laser lift-off of the light-emitting chip and the welding process of the light-emitting chi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/15H01L33/00
CPCH01L27/156H01L33/0093H01L33/38H01L33/62H01L33/52H01L33/04H01L2933/0033
Inventor 田文亚郭恩卿王程功
Owner CHENGDU VISTAR OPTEOLECTRONICS CO LTD