Manufacturing process of a flexible circuit board
A flexible circuit board and manufacturing process technology, applied in printed circuit manufacturing, circuit bendable/stretchable components, printed circuits, etc., can solve problems such as solder joint damage, PCB thickness, and circuit board manufacturing difficulties. Achieve the effect of improving precision, improving stability, improving reliability and stability
Active Publication Date: 2022-05-06
深圳市蓝特电路板有限公司
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Problems solved by technology
[0002] With the development of smart wearable hardware, smart hardware such as smart watches have been designed and developed. The card holder of the SIM card of the existing smart watch is welded on the PCB board, but the PCB board is relatively thick, and it is difficult to reduce the size of the smart watch. Thickness, for this reason people invented to weld the card holder of the SIM card on the FPC. Although the FPC is relatively thin, it is too soft, and it is easy to damage the welding point when inserting the card. Therefore, people use special-shaped steel sheets to strengthen the FPC. The strength of the connection between the FPC and the card socket of the SIM card is improved, but this brings some difficulties to the manufacture of the circuit board.
Method used
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Embodiment Construction
[0041] Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0042] Such as Figure 1 to Figure 9 As shown, a manufacturing process of a flexible circuit board in this embodiment includes the following steps:
[0043] S01. To make FPC, cut the double-sided copper foil adhesive-free base material into a fixed size, and after drilling, hole metallization, cleaning, dry film application, exposure, development, etching and film removal, AOI detection and chemical cleaning, the finished product is obtained. FPC for front and back wiring;
[0044] S02. Paste the cover film, align the cover film and attach it to the FPC, and press and cure it;
[0045] S03, making the FPC solder resist layer, screen-printing photosensitive ink on the front and back of the FPC, after pre-baking, exposure, development, curing and cleaning, to obtain the FPC with the solder resist layer completed;
[0046] S04, immersion gold, grinding...
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The invention discloses a manufacturing process of a flexible circuit board, comprising: making FPC, pasting cover film, making FPC solder resist layer, sinking gold, flying probe test, pasting electromagnetic protective film, first cutting shape, assembling small steel sheet , SMT patch, assembly of special-shaped steel sheet, second cutting shape, paste conductive foam, sound-permeable membrane and waterproof glue, test, final inspection, packaging and storage; the flexible circuit board produced by the present invention has Combining all the advantages of the board, it can reduce the thickness of the hard board area in the soft-rigid board at the same time, and can reduce the thickness of the end product.
Description
【Technical field】 [0001] The invention relates to a manufacturing process of a flexible circuit board. 【Background technique】 [0002] With the development of smart wearable hardware, smart hardware such as smart watches have been designed and developed. The card holder of the SIM card of the existing smart watch is welded on the PCB board, but the PCB board is relatively thick, and it is difficult to reduce the size of the smart watch. Thickness, for this reason people invented to weld the card holder of the SIM card on the FPC. Although the FPC is relatively thin, it is too soft, and it is easy to damage the welding point when inserting the card. Therefore, people use special-shaped steel sheets to strengthen the FPC. The strength of the connection between the FPC and the card holder of the SIM card is improved, but this brings some difficulties to the manufacture of the circuit board. [0003] The present invention researches and proposes aiming at the deficiencies in th...
Claims
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IPC IPC(8): H05K3/00H05K1/02H05K3/28
CPCH05K3/0061H05K1/0281H05K3/282
Inventor 王步高陈路生肖厚富
Owner 深圳市蓝特电路板有限公司