Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High-frequency protection single-sided glue preparation method

A single-sided adhesive, high-frequency technology, applied in the direction of adhesives, non-polymer adhesive additives, film/sheet adhesives, etc., can solve the problem of light and thin products that cannot meet the general performance of electronic equipment and polymer colloids , Tape use effect is not ideal and other problems, to improve the performance of the colloid, to avoid damage, to protect the effect of magnetic field interference

Inactive Publication Date: 2019-11-12
广东亚龙兴新材料有限公司
View PDF2 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The antimagnetic or thermally conductive tapes currently used are generally made of antimagnetic or thermally conductive substrates coated with antimagnetic or thermally conductive adhesives. The obtained adhesive tape has unsatisfactory use effect
[0003] These products have single functions and cannot achieve all-round protection, and the thinner and lighter products cannot meet the needs of electronic equipment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-frequency protection single-sided glue preparation method
  • High-frequency protection single-sided glue preparation method
  • High-frequency protection single-sided glue preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0030] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0031] In addition, the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a high-frequency protection single-sided glue preparation method, which comprises that one surface of a metal substrate layer is compounded with an anti-magnetic heat dissipation layer, and the other surface of the metal substrate is compounded with a piercing type heat conducting layer. According to the present invention, one surface provides electric conduction shieldingfunction, and the other surface provides magnetic field absorption shielding function, such that the whole functions are heat conduction and heat dissipation; and the product solves the problems of high electromagnetic interference and high heat generation caused by strong signal transmission in a high frequency process.

Description

technical field [0001] The invention relates to the technical field of film manufacturing, in particular to a preparation method of high-frequency protective single-sided adhesive. Background technique [0002] The antimagnetic or thermally conductive tapes currently used are generally made of antimagnetic or thermally conductive substrates coated with antimagnetic or thermally conductive adhesives. The obtained adhesive tape has an unsatisfactory use effect. [0003] These products have single functions and cannot achieve all-round protection, and the thinner and lighter products cannot meet the needs of electronic equipment. Contents of the invention [0004] The main purpose of the present invention is to provide a preparation method of high-frequency protective single-sided adhesive to solve the deficiencies in the technical background. [0005] In order to achieve the above object, the preparation method of the high-frequency protective single-sided adhesive propose...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/28C09J7/38C09J7/40C09J11/04
CPCC09J11/04C09J7/28C09J7/38C09J7/40C09J2301/122C09J2301/30C09J2301/302C09J2301/408
Inventor 李建赟
Owner 广东亚龙兴新材料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products