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A kind of nano-niobium aluminum yttrium/amorphous silicon nitride dual-phase superhard coating and its deposition method

A technology of niobium aluminum yttrium nitride and crystalline silicon nitride, applied in coating, metal material coating process, vacuum evaporation coating, etc. Solve problems such as low solid solution stability, and achieve the effect of good heat resistance and reduction of defects such as burrs and nail heads

Active Publication Date: 2021-07-23
JIANGXI SCI & TECH NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The second important reason is that even if a dual-phase composite structure can be formed, the existence of certain impurities in the coating will weaken the dual-phase interface. For example, there is a certain amount of O impurities in the coating, and the highly electronegative O and Si The combination of Si-O bonds will weaken the valence bond strength of the neighbors, and the hardness of the coating can only reach 35GPa or even lower; in addition, the Si-O bond will limit the decomposition of TM-Si-N solid solution and the nc-TMN / a-Si 3 N 4 Formation
The Nb-Si-N solid solution has low stability and is more prone to phase separation at lower temperatures to form nanocrystalline NbN implanted in amorphous Si 3 N 4 composite structure

Method used

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  • A kind of nano-niobium aluminum yttrium/amorphous silicon nitride dual-phase superhard coating and its deposition method

Examples

Experimental program
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Effect test

Embodiment 1

[0021] Tungsten carbide PCB micro drill, shank diameter 3.175mm, blade diameter 0.2mm, after degreasing, organic solvent cleaning, deionized water rinsing, drying, then put into the coating furnace. Vacuum to 1.0×10 -3 Below Pa, the temperature is kept at 200±5°C. The first step is to perform gas plasma cleaning on the workpiece substrate: Ar and H are introduced through the gas ion source 2 , the partial pressures are 0.2Pa and 0.1Pa respectively, the ion source current is 5A, the workpiece is applied with a pulsed negative bias, the frequency is 80KHz, the peak value is 100V, and the duty cycle is 90%, and the workpiece is plasma cleaned for 30min. The second step is to perform arc plasma cleaning on the workpiece: turn off the gas ion source, adjust the pulse negative bias to frequency 80KHz, peak value 700V, duty cycle 30%, Ar and H 2 The partial pressure is adjusted to 0.1Pa and 0.05Pa, the arc ion plating Nb target is turned on, the arc source current is 60A, and the w...

Embodiment 2

[0023] Tungsten carbide PCB micro drill, shank diameter 3.175mm, blade diameter 0.35mm, after degreasing, organic solvent cleaning, deionized water rinsing, drying, then put into the coating furnace. Vacuum to 1.0×10 -3 Below Pa, the temperature is kept at 200±5°C. The first step is to perform gas plasma cleaning on the workpiece substrate: Ar and H are introduced through the gas ion source 2 , the partial pressures are 0.2Pa and 0.1Pa respectively, the ion source current is 5A, the workpiece is subjected to pulsed negative bias, the frequency is 80KHz, the peak value is 150V, and the duty cycle is 90%, and the workpiece is plasma cleaned for 30min. The second step is to perform arc plasma cleaning on the workpiece: turn off the gas ion source, adjust the pulse negative bias to frequency 80KHz, peak value 800V, duty cycle 30%, Ar and H 2 The partial pressure is adjusted to 0.1Pa and 0.05Pa, the arc ion plating Nb target is turned on, the arc source current is 60A, and the wo...

Embodiment 3

[0025] The tungsten carbide PCB milling cutter with a shank diameter of 3.175mm and a blade diameter of 1.2mm is degreased, cleaned with organic solvents, rinsed with deionized water, dried, and loaded into a coating furnace. Vacuum to 1.5×10 -3 Below Pa, the temperature is kept at 250±5°C. The first step is to perform gas plasma cleaning on the workpiece substrate: Ar and H are introduced through the gas ion source 2 , the partial pressures are 0.2Pa and 0.1Pa respectively, the ion source current is 8A, the workpiece is applied with a pulsed negative bias, the frequency is 80KHz, the peak value is 200V, and the duty cycle is 90%, and the workpiece is plasma cleaned for 30min. The second step is to perform arc plasma cleaning on the workpiece: turn off the gas ion source, adjust the pulse negative bias to frequency 80KHz, peak value 1000V, duty cycle 30%, Ar and H 2 The partial pressure is adjusted to 0.1Pa and 0.05Pa, the arc ion plating Nb target is turned on, the arc sour...

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Abstract

The invention relates to a nanometer niobium aluminum yttrium / amorphous silicon nitride dual-phase superhard coating and a deposition method thereof. The superhard coating has a four-layer structure: the innermost layer is a pure niobium bonding layer with a thickness of 0.05 ‑0.5 microns; the second inner layer is a niobium nitride transition layer with a thickness of 0.05‑1.0 microns; the second outer layer is a gradient layer, the composition of niobium nitride gradually decreases from the inside to the outside, and the composition of niobium aluminum yttrium nitride / silicon nitride gradually increases , the thickness is about 0.1-1.0 microns, which can prevent the concentration on the stress interface; the outermost layer is a niobium aluminum yttrium nitride / silicon nitride composite wear-resistant layer, with a thickness of 1-10 microns; the total thickness of the coating is 1.2-12.5 microns. The bonding force between the coating and the cemented carbide substrate is 70-105N, the hardness of the coating is 40-60GPa, the friction coefficient is 0.20-0.55, the oxidation resistance temperature of the coating is above 750°C, and the life of the coated micro drill or milling cutter is longer than that of the uncoated micro drill Drilling or milling cutters increased by 4‑8 times.

Description

technical field [0001] The invention relates to a nanometer niobium aluminum yttrium nitride / amorphous silicon nitride dual-phase superhard coating for hard alloy cutting tools and a deposition method thereof, belonging to the field of mechanical processing and new materials. Background technique [0002] With the tremendous development of the printed circuit board (PCB) industry, the consumption of milling cutters and micro drills for PCB processing in mainland China reaches several billion pieces every year. In recent years, the increase in the number of layers of circuit boards, the increase in cutting speed, and the large number of applications of difficult-to-drill materials such as halogen-free have put forward higher requirements for the cutting performance of milling cutters and micro-drills, prompting people to explore suitable PCB milling cutters and micro-drills. surface strengthening technology. For fine-grained carbide PCB milling cutters and micro-drills whose...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/02C23C14/16C23C14/06C23C14/32
CPCC23C14/0021C23C14/025C23C14/0641C23C14/16C23C14/325
Inventor 李明升张琳英易家骏陈土春吴志诚
Owner JIANGXI SCI & TECH NORMAL UNIV