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Packaging substrate and method for preparing display panel

A technology for encapsulating substrates and display panels, applied in identification devices, semiconductor/solid-state device manufacturing, instruments, etc., can solve the problems of low yield rate of follow-up products, and achieve the effect of avoiding misjudgment, avoiding low yield rate, and improving accuracy

Active Publication Date: 2021-09-28
SUZHOU QUINGYUE OPTOELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, an embodiment of the present invention provides a packaging component, a display component, and a method for preparing a display panel, so as to solve the problem of low yield rate of follow-up products caused by existing tests on display panels

Method used

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  • Packaging substrate and method for preparing display panel
  • Packaging substrate and method for preparing display panel
  • Packaging substrate and method for preparing display panel

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Embodiment Construction

[0045] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.

[0046] An embodiment of the present invention provides a packaging substrate, which is used for packaging a package to be packaged. Among them, before encapsulation, such as figure 1 As shown, the package substrate 10 is divided into a package area 11 and a conductive area 12 . Wherein, the packaging area 11 is used to package the package to be package...

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Abstract

The present invention relates to the field of display technology, in particular to a method for preparing a packaging substrate and a display panel, wherein the packaging substrate includes: a packaging area corresponding to a display area of ​​a body to be packaged; a conductive area corresponding to an electrode binding area of ​​the body to be packaged Corresponding; wherein, the conductive area has a conductive block and a lead, and the conductive block is adapted to the electrode lead of the to-be-packaged body for connection with the electrode lead. Use the conductive blocks and leads in the conductive area to connect the electrode leads of the packaged body to realize the good product test of the packaged body, and during the test process, the conductive block is pressed on the electrode leads; The connection will not affect the electrode leads, so that on the premise of realizing the lighting of a large area of ​​the package to be tested, the problem of low yield rate of subsequent products caused by the oxidation of the electrode leads is avoided.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for preparing a packaging substrate and a display panel. Background technique [0002] During the preparation process of the display panel, the entire surface is generally vapor-deposited, and then multiple single-grain display panels can be obtained at the same time through a cutting process. In order to test the performance of the display panel, a common method is to crimp a conductive adhesive strip on the electrode leads of the display panel after cutting a single display panel for lighting and screening, so as to select good products for subsequent production. However, the above-mentioned method of crimping the conductive adhesive strip may cause oxidation of the electrode leads, or residue of the adhesive strip, etc., thereby affecting the yield rate of subsequent products. Contents of the invention [0003] In view of this, an embodiment of the present inventi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G09F9/30H01L51/52
CPCG09F9/30H10K50/84
Inventor 葛鹏程于子洋郝力强廖明富马中生
Owner SUZHOU QUINGYUE OPTOELECTRONICS TECH CO LTD
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