LED backlight module and display device

Abstract

The invention discloses an LED backlight module and a display device. A plurality of luminous units are distributed on a base plate of the LED backlight module, the surface of the base plate is provided with a plurality of solder mask window areas to which the luminous units attach, conducive routes connecting two adjacent luminous units comprises a main route and an auxiliary route, and an insulating substance is spread on the base plate except the solder mask window areas. Alignment errors in spreading may result in that reserved solder mask window areas are covered and actual solder mask window areas deviate. The auxiliary route goes through the solder mask window area and the wiring direction is intersected with a connection direction of two electrodes of the luminous units, so that the auxiliary route is long enough and avoids being covered largely, therefore, the part not covered by the insulating substance can be monitored using as a pad for crystal fixing in light checking, crystal fixing failure is prevented effectively, and yield rate of LED packaging is improved greatly. The LED backlight module is applied to the field of LCD and LED display.

Description

technical field [0001] The invention relates to the fields of LCD and LED display, in particular to an LED backlight module and a display device. Background technique [0002] As people's requirements for display experience are getting higher and higher, advanced displays generally use curved surfaces or even bendable screens. Traditional LCD backlights are narrow and long backlight strips that are relatively bendable. However, with the maturity of miniature blue LED chips and direct-lit partial backlight adjustment technology, the technology using miniature LEDs as backlights has gradually become popular, and backlight strips have gradually developed into Mini LED backlight panels. The current curved LCD screen mainly uses arc-shaped side-emitting backlight strips to provide the light source, and the line light source is converted into a surface light source through the light guide plate, so it is difficult to achieve fine regional dimming. High, the side temperature of t...

AI Technical Summary

Problems solved by technology

At present, Mini LED backlight boards generally adopt a flip-chip COB structure, and solder paste is often used for soldering. The solder is generally brittle, and there are problems such as weak soldering and not easy to bear force.

[0004] like figure 1 , figure 2 Shown are the schematic diagrams of normal window opening and bad window opening of the conductive circuit in the prior art. The routing direction of the existing conductive circuit is parallel to the connection direction of the two electrodes of the light-emitting unit. In the substrate manufacturing process, the non-soldering of the substrate The plate part (that is, the part of the non-solder mask window area) needs to be coated with insulating white oil. When the alignment deviation occurs during the white oil coating process, the original preset solder mask window area will shift, resulting in The pad cannot be detected, which makes the die bonding fail

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