A kind of LED backlight module and display device

Abstract

The invention discloses an LED backlight module and a display device. A plurality of light-emitting units are distributed on the substrate of the LED backlight module, and the surface of the substrate is provided with a plurality of solder-resisting window areas for the light-emitting units to be attached to connect two adjacent light-emitting units. The conductive lines are divided into main lines and auxiliary lines; the rest of the substrate except the solder resist window area is coated with insulating material, and there is an alignment error in the coating process, which may cause the reserved solder resist window area to be covered. The actual solder resist window area is offset. Since the auxiliary line runs through the solder resist window area and the routing direction intersects with the connection direction of the two electrodes of the light-emitting unit, the auxiliary line is set long enough to avoid being covered by a large area, so that the optometry It can be monitored from time to time that the part not covered by the insulating material acts as a pad for die bonding, which effectively avoids the failure of die bonding and greatly improves the yield rate of LED packaging. This invention is used in the field of LCD and LED displays.

Description

technical field [0001] The invention relates to the fields of LCD and LED display, in particular to an LED backlight module and a display device. Background technique [0002] As people's requirements for display experience are getting higher and higher, advanced displays generally use curved surfaces or even bendable screens. Traditional LCD backlights are narrow and long backlight strips that are relatively bendable. However, with the maturity of miniature blue LED chips and direct-lit partial backlight adjustment technology, the technology using miniature LEDs as backlights has gradually become popular, and backlight strips have gradually developed into Mini LED backlight panels. The current curved LCD screen mainly uses arc-shaped side-emitting backlight strips to provide the light source, and the line light source is converted into a surface light source through the light guide plate, so it is difficult to achieve fine regional dimming. High, the side temperature of t...

AI Technical Summary

Problems solved by technology

At present, Mini LED backlight boards generally adopt a flip-chip COB structure, and solder paste is often used for soldering. The solder is generally brittle, and there are problems such as weak soldering and not easy to bear force.

[0004] like figure 1 , figure 2 Shown are the schematic diagrams of normal window opening and bad window opening of the conductive circuit in the prior art. The routing direction of the existing conductive circuit is parallel to the connection direction of the two electrodes of the light-emitting unit. In the substrate manufacturing process, the non-soldering of the substrate The plate part (that is, the part of the non-solder mask window area) needs to be coated with insulating white oil. When the alignment deviation occurs during the white oil coating process, the original preset solder mask window area will shift, resulting in The pad cannot be detected, which makes the die bonding fail

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