Cross-platform MCU debugging method

A debugging method and cross-platform technology, which is applied in software testing/debugging, data processing input/output process, software deployment, etc., can solve the problem of inability to obtain the interdependence of system operation process modules, insufficient memory area values, and inability to obtain system operating status etc.

Active Publication Date: 2019-11-15
SHANGHAI HEQIAN ELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current MCU integrates many functions. It is far from enough to only know the values ​​​​of registers, variables, and memory areas. From these data, it is impossible to obtain the operating status of the system, and it is also impossible to obtain the operating process of the system and the relationship between each module. interdependence

Method used

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  • Cross-platform MCU debugging method

Examples

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Embodiment 1

[0134] This embodiment provides a cross-platform MCU debugging device, see Figure 2 to Figure 4 , including host computer 1, MCU 2, host computer 1 includes CPU11, storage module 12, debugging instruction module 13, communication module 14, encapsulation and unpacking module 15, CPU11 respectively communicates with storage module 12, debugging module 13, communication module 14, encapsulation The unpacking module 15 is electrically connected, and the MCU 2 includes a CPU 21 , a debugging function module 22 , a communication module 24 , a storage module 23 , a packaging and unpacking module 25 , and at least one peripheral interface 26 .

[0135] The communication module 14 of host computer 1 is connected with the communication module 24 in the MCU, and wherein communication module 14 and communication module 24 all can adopt wireless communication or wired communication mode, if adopt wireless communication mode, wireless communication mode can WIFI, bluetooth, ultra-wide band...

Embodiment 2

[0171] This implementation provides a cross-platform MCU debugging method, see Figure 5 and Figure 6 , which includes two stages. The first stage includes the host computer starting the debugging command and sending it to the MCU according to the debugging requirements. After receiving the debugging command, the MCU starts the corresponding debugging function module to debug the MCU;

[0172] The second stage includes sending the data generated by MCU debugging to the host computer for display. The data generated by MCU debugging includes at least logs, which are divided into multiple log levels according to the type. In the process of debugging the MCU, temporarily store the data that needs to be output in the memory, and wait for the external output when the system is idle. Or when it is found that the debugging function module in the MCU does not have a built-in preset function module or according to the debugging requirements, it is necessary to add a special function m...

Embodiment 3

[0201] This embodiment provides a data encapsulation and data unpacking method, which is completed by an encapsulation and unpacking module.

[0202] The data encapsulation method includes the following steps:

[0203] Step S701, obtaining the payload (payload) that needs to be packaged and obtaining the address, length, and data packet type of the payload therefrom;

[0204] Specifically, the payload that needs to be transmitted already exists, and it needs to be packaged when transmitting, and the payload can be transmitted according to the type of the data packet by adding a header;

[0205] Step S702, judging whether the address is valid, if the address is invalid, execute step S707, and end the packaging process; if the address is valid, execute step S703;

[0206]Specifically, since the load data is stored in segments, it is searched in the storage area according to the obtained address whether the address exists, and if the address exists, it means that the address is ...

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Abstract

The invention provides a cross-platform MCU debugging method, which comprises an upper computer and an MCU, and is characterized by at least comprising the following steps that: the upper computer starts a debugging instruction module to send a debugging instruction to the MCU according to a debugging requirement, and the MCU starts a corresponding debugging function module to debug the MCU afterreceiving the debugging instruction; the debugging instruction module is configured to call a corresponding debugging instruction to debug the MCU according to a debugging demand; and the debugging function module is configured to correspond to the debugging instruction module and start the corresponding debugging function module to debug the MCU according to the debugging instruction issued by the debugging instruction module. Compared with an existing MCU debugging method, the cross-platform MCU debugging method directly adopts the MCU and the upper computer for assembly debugging while doesnot adopts a special debugging tool as an intermediate medium, so that the debugging cost is reduced, and the debugging method is flexible and variable.

Description

technical field [0001] The present invention relates to the field of Microcontroller Unit (MCU), in particular to a method for debugging the faults of the MCU in the development process of the automobile MCU or the developed MCU. Background technique [0002] With the popularization of automobiles, more and more automobiles have entered thousands of households. Now the rapid development of information technology has made people put forward higher requirements for intelligent automobiles. It is hoped that intelligent automobiles can bring convenience to people's practicality. An intelligent vehicle is a comprehensive system that integrates functions such as environmental perception, planning and decision-making, and multi-level assisted driving. It uses technologies such as computers, modern sensing, information fusion, communication, artificial intelligence, and automatic control. technology complex. At present, the research on intelligent vehicles is mainly devoted to impr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F11/36G06F11/34G06F8/65G06F3/12
CPCG06F11/362G06F11/3648G06F11/3476G06F8/65G06F3/1237
Inventor 肖文平王子祥陈柱张航
Owner SHANGHAI HEQIAN ELECTRONICS TECH CO LTD
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