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Film-like adhesive composite sheet and method for manufacturing semiconductor device

A technology of adhesives and composite sheets, which is applied in the direction of film/sheet adhesives, semiconductor/solid device manufacturing, semiconductor devices, etc., can solve problems such as poor productivity and cooling process, and achieve the effect of suppressing process abnormalities

Active Publication Date: 2022-02-08
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is sometimes necessary to cool the film-like adhesive so that it can be cut and expanded, but in this case, a cooling process is required, and the productivity is poor.

Method used

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  • Film-like adhesive composite sheet and method for manufacturing semiconductor device
  • Film-like adhesive composite sheet and method for manufacturing semiconductor device
  • Film-like adhesive composite sheet and method for manufacturing semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0224] [Preparation Method of Adhesive Composition]

[0225] The adhesive composition can be obtained by blending the respective components for constituting it.

[0226] The order of addition when blending each component is not specifically limited, Two or more components may be added simultaneously.

[0227] When a solvent is used, it may be used by mixing the solvent with any blended ingredients other than the solvent and diluting the blended ingredients in advance, or without diluting any blended ingredients other than the solvent in advance, by mixing the solvent with these Blending Ingredients are mixed for use.

[0228] The method of mixing the components is not particularly limited, and may be appropriately selected from the following known methods: a method of mixing by rotating a stirrer or a stirring blade; a method of mixing by using a stirrer; and mixing by applying ultrasonic waves. method etc.

[0229] The temperature and time at the time of adding and mixing ...

Embodiment 1

[0351] (Preparation of Adhesive Composition)

[0352] Polymer component (a)-1 (10.30 parts by mass), epoxy resin (b1)-1 (26.46 parts by mass), epoxy resin (b1)-3 (16.45 parts by mass), thermosetting agent (b2)- 1 (36.21 parts by mass), curing accelerator (c)-1 (0.22 parts by mass), filler (d)-1 (9.36 parts by mass) and silane coupling agent (e)-1 (1.00 parts by mass) dissolved or By dispersing in methyl ethyl ketone and stirring at 23° C., an adhesive composition having a solid content concentration of 60 mass % was obtained as an adhesive composition.

[0353] (Manufacture of film adhesive composite sheet)

[0354] The pressure-sensitive adhesive composition obtained above was coated on a release film ("SP-PET381031" manufactured by Lintec Corporation, thickness: 38 μm) of a polyethylene terephthalate film with a release treatment on one side. The peeling-treated surface was dried at 110° C. for 3 minutes to form a film-like adhesive having a thickness of 10 μm. Next, one ...

Embodiment 2

[0356] In addition to replacing the support sheet (1) used in Example 1 with the support sheet (2), and attaching the glossy side of the support sheet (2) to the exposed surface of the film adhesive, the 1 The film-like adhesive composite sheet was produced in the same manner.

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Abstract

The present invention provides a film-shaped adhesive composite sheet, which is provided with a curable film-shaped adhesive on a support sheet, the support sheet has a base material, and the thickness of the curable film-shaped adhesive is 1-60 μm. The product of the Young's modulus of the support sheet and the thickness of the support sheet is 4 to 150 MPa·mm.

Description

technical field [0001] The present invention relates to a film-like adhesive composite sheet and a method for manufacturing a semiconductor device. [0002] This application claims priority based on Japanese Patent Application No. 2017-063654 for which it applied in Japan on March 28, 2017, and uses the content here. Background technique [0003] In a manufacturing process of a semiconductor device, a semiconductor chip to which a film-like adhesive for die bonding is stuck is used in some cases. As one of the methods of obtaining such a semiconductor chip with a film-shaped adhesive, there is a method in which a film-shaped adhesive is attached to a plurality of singulated semiconductor chips obtained by dicing a semiconductor wafer, and then The film-like adhesive is cut at a position corresponding to the placement position of the semiconductor chip. In this method, the film adhesive is usually attached to a plurality of semiconductor chips using a film adhesive composit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/22C09J201/00H01L21/52H01L21/301
CPCC09J7/22C09J201/00H01L21/52H01L2224/83191C09J2301/312C09J2203/326
Inventor 佐川雄太布施启示
Owner LINTEC CORP
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