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Laminate and saw device

A layered body and main surface technology, which is applied to electrical components, impedance networks, etc., can solve the problems of increased production costs of SAW devices

Pending Publication Date: 2019-11-22
SUMITOMO ELECTRIC IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if such a substrate formed of single crystal sapphire is used as the base substrate, the production cost of the SAW device increases

Method used

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  • Laminate and saw device
  • Laminate and saw device
  • Laminate and saw device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0022] First, embodiments of the present invention will be listed and described. A layered body according to the present application includes a ceramic substrate formed of polycrystalline ceramics and having a supporting main surface, and a piezoelectric substrate formed of a piezoelectric material and having a bonded main surface bonded to the supporting main surface by van der Waals force. The ceramic substrate includes a supporting major surface amorphous layer formed to include the supporting major surface. The piezoelectric substrate includes a bonded major surface amorphous layer formed to include the bonded major surface. The thickness of the supporting major surface amorphous layer is less than the thickness of the bonding major surface amorphous layer.

[0023] In the layered body according to the present application, the supporting main surface of the ceramic substrate and the bonding main surface of the piezoelectric substrate are bonded to each other by van der Wa...

Embodiment

[0055] Steps ( S10 ) to ( S40 ) according to the above-described embodiment were performed to manufacture layered body 1 , and experiments were performed to examine the bonding strength between base substrate 10 (ceramic substrate) and piezoelectric substrate 20 . Specifically, a base substrate 10 formed of polycrystalline spinel and a piezoelectric substrate 20 formed of single crystal lithium tantalate are provided in step (S10), and steps (S20) to (S40) are performed to manufacture a layered Body 1. By differentiating the irradiation conditions of Ar beams in the step (S30), two kinds of layered bodies 1 (sample A and sample B) were produced.

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Abstract

A laminate is provided with: a ceramic substrate which is configured from a polycrystalline ceramic and has a supporting main surface; and a piezoelectric substrate which is composed of a piezoelectric body and has a bonding main surface that is bonded to the supporting main surface by the van der Waals force. The ceramic substrate comprises a supporting main surface amorphous layer which is formed so as to contain the supporting main surface. The piezoelectric substrate comprises a bonding main surface amorphous layer which is formed so as to contain the bonding main surface. The thickness ofthe supporting main surface amorphous layer is smaller than the thickness of the bonding main surface amorphous layer.

Description

technical field [0001] The present invention relates to a layered body and a SAW device. [0002] This application claims priority based on Japanese Patent Application No. 2017-060774 filed on March 27, 2017, the entire contents of which are incorporated herein by reference. Background technique [0003] SAW devices (surface acoustic wave devices) are installed in communication equipment such as mobile phones in order to remove noise contained in electric signals. The SAW device has a function of extracting only an electric signal having a desired frequency among input electric signals. The SAW device has a structure in which electrodes are formed on a piezoelectric substrate. In order to dissipate heat during operation, the piezoelectric substrate is provided on a base substrate formed of a material having good heat dissipation properties. [0004] For example, a substrate formed of single crystal sapphire can be used as the base substrate. However, if such a substrate ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/25
CPCH03H9/02574H03H9/02826H03H9/02834H03H3/08H03H9/02559H03H9/08H03H9/64
Inventor 下司庆一郎山口辽太长谷川干人
Owner SUMITOMO ELECTRIC IND LTD
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