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relay

A technology for relays and electronic components, applied in circuits, printed circuits, printed circuits, etc., can solve the problems of increased installation area, difficulty in realizing space saving of printed substrates, etc., and achieve the effect of space saving

Active Publication Date: 2022-03-15
ORMON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the solid state relay, the two lead terminals extend in opposite directions along the printed board from both ends in the extending direction of the internal printed board. Therefore, the mounting area when mounted on the printed board increases, and sometimes Difficult to save space on printed circuit boards

Method used

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Examples

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Embodiment Construction

[0021] Embodiments of the present invention will be described below with reference to the drawings. In addition, in the following description, terms indicating a specific direction or position (for example, terms including "upper", "lower", "right", "left", "end", and "side") are used as necessary. , this is because the use of these terms makes it easy to understand the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meanings of these terms. In addition, the following description is only an illustration in nature, and is not intended to limit this invention, its application, or its use. In addition, the drawings are schematic diagrams, and ratios of dimensions and the like do not necessarily match actual ones.

[0022] Such as figure 1 As shown, a relay 1 according to an embodiment of the present invention includes a relay body 10 and a case 50 covering the relay body 10 .

[0023] Such as figure 2 As shown,...

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PUM

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Abstract

The relay has a relay main body (10), which has a base (20) including a first surface (21), and a second surface (22) on the opposite side of the first surface (21) to a side crossing the first surface (21). The relay substrate part (30) extending in the direction and integrally provided with the base part (20); the casing (50), which is installed on the relay body (10) and covers the relay substrate part (30), and is filled with a sealing material inside. The relay main body (10) has a substrate connecting portion (23) disposed on the first surface (21) of the base (20), an electronic component mounting portion (33) disposed on the relay substrate portion (30), and an electronic component mounting portion (33) disposed on the base (20). And the conductive part (40) on the surface of the relay board part (30), and the electronic component (34) mounted on the electronic component mounting part (33).

Description

technical field [0001] The present invention relates to relays such as solid state relays. Background technique [0002] Patent Document 1 discloses a surface mount type solid state relay. The solid state relay includes an internal printed circuit board on which electronic components are mounted, two lead terminals extending from the internal printed circuit board to the outside of the case and connected to the printed circuit board on the outside of the case, and a case in which the internal printed circuit board is molded. In this solid state relay, the inner printed substrate extends parallel to the printed substrate. [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent Application Publication No. 02-008065 [0006] The technical problem to be solved by the invention [0007] However, in the solid state relay, the two lead terminals extend in opposite directions along the printed board from both ends in the extending dir...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/14H01R12/51H05K1/02H05K3/00H05K3/28H05K7/14
CPCH01R12/51H05K3/0014H05K2201/09118H05K1/0284H05K2201/10053H05K3/366H05K1/119H05K2201/09181H05K3/3442Y02P70/50H05K1/117H05K1/181H05K5/0069H05K5/064H05K2201/09027H05K2201/09409H05K2201/09472H05K2201/09754
Inventor 下田大智岸川和宗北原康行白石智纪前田繁幸藤瀬悠太下田城毅
Owner ORMON CORP