Detection system for substrate damages, semiconductor machine and detection method

Abstract

The invention provides a detection system for substrate damages, a semiconductor machine and a detection method. A pressure sensor is arranged on an ejector pin, when a substrate is jacked up and before the substrate is transmitted to a public path, whether the substrate is damaged or not can be judged by judging whether the pressure sensed by the pressure sensor meets a preset condition, so thatwhether the substrate is damaged or not can be judged in advance before the substrate enters the public path, damage to the semiconductor machine by the damaged substrate is avoided, and meanwhile, the damaged substrate is prevented from polluting the public path, thereby avoiding cleaning the public path due to the damaged substrate, so that the working efficiency of the semiconductor machine canbe improved; and further, the substrate needs to be jacked away from an electrostatic chuck before entering the public path, so that whether the substrate is damaged or not is detected in the processof jacking up the substrate by the ejector pin, and the efficiency of the semiconductor machine can be further improved.

Description

technical field [0001] The present application relates to the technical field of semiconductor manufacturing, in particular to a detection system for substrate damage, a semiconductor machine and a detection method. Background technique [0002] Semiconductor etching includes two methods: dry etching and wet etching. Among them, dry etching is to excite the substrate such as the gas around the substrate into plasma, and the plasma bombards the surface of the substrate under the guidance of a bias voltage, and reacts with the substrate physically and chemically, thereby etching the desired shape on the surface of the substrate. When the substrate is etched in the process chamber, after the plasma discharge, the thimble in the process chamber will lift the substrate. When the sensor of the thimble senses that the thimble is lifted, the vacuum transfer arm located in the transfer chamber will grab the substrate for the next step of the process. [0003] But at present, becaus...

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Problems solved by technology

[0003] But at present, because the thimble in the process chamber does not have the function of detecting whether the substrate lifted by the thimble is damaged, therefore, when the substrate in the process chamber is damaged, the thimble in the process chamber will still rise normally. When the thimble lifts up the substrate, the vacuum transfer arm located in the transfer chamber will continue to take the film. During the process of taking the film by the vacuum transfer arm, the vacuum transfer arm collides with the damaged substrate, which may cause the following problems: Damage to the vacuum transfer arm, when the vacuum transfer arm grabs the broken substrate will cause the broken substrate to pollute the entire reaction chamber and transfer the damaged substrate to the common path of the semiconductor machine, resulting in the entire semiconductor machine Pollution requires opening and cleaning, thus delaying the running time of the semiconductor machine, which will also lead to a decrease in work efficiency, and in severe cases, it will also cause the downtime of the semiconductor machine, which will increase production costs and reduce work efficiency

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