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A circuit board and electronic equipment

A technology for circuit boards and sub-circuit boards, applied in printed circuits, printed circuit components, circuit inspection/identification, etc., can solve the problems of long design circuit diagram and experiment cycle, high cost, shorten the cycle of circuit design and experiment, The effect of reducing the volume and reducing the tile area

Active Publication Date: 2020-12-04
GUANGDONG HONGQIN COMM TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides a circuit board and electronic equipment, which are used to solve the technical problems of the technical research and development personnel in the process of developing the circuit in the prior art, such as the design circuit diagram and the high cost of the experimental period.

Method used

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  • A circuit board and electronic equipment
  • A circuit board and electronic equipment
  • A circuit board and electronic equipment

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Embodiment Construction

[0022] In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] In the prior art, when the technical research and development personnel design the circuit diagram, it is necessary to make the circuit in the designed circuit diagram into a circuit board and test it. Different technical solutions need to make different circuit boards and test them, so different circuit boards are produced and tested. Testing makes the cycle of designing circuit diagrams and experiments longer and increases costs...

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PUM

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Abstract

The embodiment of the invention discloses a circuit board and electronic equipment. The circuit board comprises a main circuit board. The main circuit board comprises a first area. N solder spots arearranged in the first area, and the N solder spots at least include a first group of solder spots and a second group of solder spots. The first group of solder spots are connected with the first circuit structure in the main circuit board, and the second group of solder spots are connected with the second circuit structure in the main circuit board. The first group of solder spots include first solder spots and the second group of solder sports include second solder sports. The first solder sports are different from the second solder sports. A plurality of groups of solder sports are arrangedin the first area of the main circuit board and multiple technical schemes can be realized by connecting the secondary circuit boards corresponding to a plurality of groups of solder spots respectively so that the technical problems of long period and high cost of designing the circuit diagram and experiment of technical research and development personnel in the process of developing circuits canbe solved.

Description

technical field [0001] The present application relates to the field of printed circuit board (PCB), in particular to a circuit board and electronic equipment. Background technique [0002] With the development and popularization of electronic equipment, the functions of various electronic equipment are becoming more and more perfect, and therefore the volume of electronic equipment also increases with the complexity of internal circuits. In order to reduce the volume of electronic equipment and reduce the gap between electronic parts Wiring and printed circuit boards were born under the continuous attempts and improvements of engineers. [0003] The emergence of printed circuit boards has made the development of electronic equipment more rapid. The printed circuit board is made of multi-layer insulating layers and multi-layer metal layers. By making the metal sheet into a mesh circuit, the metal mesh is separated by the insulating layer and the gap between the mesh is fille...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11H05K1/02
CPCH05K1/0268H05K1/111
Inventor 范兵兵
Owner GUANGDONG HONGQIN COMM TECH CO LTD