Ribbon cutting molding die for integrated circuit packaging

Abstract

The invention discloses a molding die for cutting ribs for integrated circuit packaging, which comprises an upper molding die and a lower molding die arranged up and down, the upper molding die includes an upper molding template, a punching gate punch installed on the upper molding template, and a rib cutting convex mold. mold, cutting punch, forming punch, and the lower forming die includes a lower forming template and a punching gate die, a rib cutting die, a cutting die, and a forming die installed on the lower forming template. In the present invention, the pouring sprue mould, rib cutting mould, cutting mould, and forming mould, are arranged on the upper and lower templates, so that the semi-finished chip material passes through sequentially, and the plastic injection and detachment of the plastic package, chip rib cutting, chip cutting, and chip forming are completed in sequence. The integrated process of chip cutting and molding has been realized, and a separation die is set to eject the formed chip material to obtain the formed chip material. At the same time, two sets of cutting dies are set, and the two sets of cutting dies are cut at intervals. In this way, the material passes through two sets of cutting dies in sequence to complete chip cutting.

Description

technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to an integrated circuit packaging rib cutting molding die. Background technique [0002] Chip packaging is a shell for installing semiconductor integrated circuit chips. It plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance. It is also a bridge between the internal world of the chip and the external circuit-the contacts on the chip are connected to On the pins of the package shell, these pins are connected to other devices through the wires on the printed board. Therefore, the package plays an important role for the CPU and other LSI integrated circuits. With the rapid development of the domestic electronics industry, The scale of integrated circuit packaging production continues to expand, and the packaging technology continues to improve from DIP, SOP, TSOP, TQFP to BGA. In order to complete the cuttin...

AI Technical Summary

Problems solved by technology

[0002] Chip packaging is a shell for installing semiconductor integrated circuit chips. It plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance. It is also a bridge between the internal world of the chip and the external circuit-the contacts on the chip are connected to On the pins of the package shell, these pins are connected to other devices through the wires on the printed board. Therefore, the package plays an important role for the CPU and other LSI integrated circuits. With the rapid development of the domestic electronics industry, The scale of integrated circuit packaging production continues to expand, and the packaging technology continues to improve from DIP, SOP, TSOP, TQFP to BGA. In order to complete the cutting and forming of chips, multiple molds are often required to be processed in a single process, which reduces production efficiency and improves operators. labor intensity

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